INFINITE AUTOMATION CO ., LIMITED
                                                                                                           
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20 Years
Since 2006
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Machinery Production line Packaging processing line

450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine

Price Negotiable
Price: Negotiable
MOQ: 1 unit
Delivery Time: Negotiable
Brand: INFINITE™
Product Description

450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine

 

BGA Loading And Unloading Machine BGA Board Feeding Operation In The Semiconductor Production Line

 

INFINITE™ BGA Loading and Unloading Machine is a type of production equipment used for semiconductor packaging and testing, washing the front end of the line body, transferring the BGA board to the lower computer equipment through magazine storage with automatic feeding function. This BGA loading and unloading equipment is a required machine for BGA board feeding operation in the semiconductor production line. INFINITE™ BGA Loading and Unloading Machine adopts PLC control and an easy-to-operate touch screen control. Equipped by a servo motor for lifting and translation, lifting and transfer spacing can be set arbitrarily. INFINITE™ BGA Loading and Unloading Machine use a stepping motor as controller and the frame change method adopts the platform multi-frame storage method, with single-frame feeding and multiple-frame simultaneous feeding functions. Mechanical clamping type bin positioning method, which can adjust different size bins arbitrarily. Equipped with standard SMEMA communication port, which can communicate with other automation equipment.

 

Features:

  • Mainly used for semiconductor packaging and testing, washing the front end of the line body, transferring the BGA board to the lower computer equipment through the magazine storage method, with automatic feeding function. 
  • The control system adopts PLC control.
  • The operation interface adopts a touch screen.
  • The lifting and translation are controlled by a servo motor, and the lifting and transfer spacing can be set arbitrarily.
  • Stepping motor controlled
  • The frame change method adopts the platform multi-frame storage method, with single-frame feeding and multiple-frame simultaneous feeding functions.
  • Mechanical clamping type bin positioning method, which can adjust different size bins arbitrarily.
  • Equipped with standard SMEMA communication port, which can communicate with other automation equipment.

 

TECHNICAL PARAMETERS
Description This equipment is used for the BGA board feeding operation in the semiconductor production line
Time feed PCB 6.0-16 sec (or customer specified)
Power supply AC220V±10V, 50/60HZ
Power 450W
Air pressure 4-6 bar up to 10 liters per minute
Transport height 900±20mm (or customized)
Transport direction

From left to right or right to left

 

 

SPECIFICATIONS
Model Dimension PCB size Rack size Weight Circuit
(L*W*H MM) (MM) (L*W*H, MM) (KG) Board
        thickness
BLD-600A 1175*1000*1080 mm 80*50-330*120 50*80*100-300*150*400 240 Minimum
M/L/LL/XL 0.2-2.0mm
  thickness
BUL-600A 1175*1000*1080 mm 80*50-330*120 50*80*100-300*150*400 245 Minimum
M/L/LL/XL 0.2-2.0mm
  thickness

 

 

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Company INFINITE AUTOMATION CO ., LIMITED
Location Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China
Contact Person Rosy Shao

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