Omron VT S530 SMT AOI Machine Automatic Optical Inspection Machine
Omron VT S530 SMT AOI Machine Automatic Optical Inspection Machine
Omron 3D AOI VT-S530, Original and Used Automatic Optical Inspection Machine
Omron VT-S530 is Industries Highest Value Full 3D-AOI System. The VT-S530 provides Full 3D-AOI capability, High performance, Highest First Pass Yield, Zero Escape, and lowest False Rejects amongst other strengths. VT-S530 series with Pre - Post Reflow configurations have been widely adopted in production lines where high value and quality control is required. VT-S530 Series uses a combination of Phase Shift and Omron’s unique color image processing technology called "color highlight ™ 3D shape reconstruction technology", providing the highest accuracy in Solder Joint Inspection called ‘SJI’. The technology available on the VT-S530 has been proven ultra-performant on the existing VT-S730-H with which it is sharing the new Image-Capture Module.
Omron 3D AOI VT-S530
- Industries Highest Value Full 3D-AOI System
- FOV: 10μ: 40×30mm
- Max PCB: 510(W)×680(D)mm
- Weight: Approx. 850kg
- Dimensions: 1180(W)×1640 (D)×1500(H) mm
Features:
- Built Upon a History of Innovation and track record of High-Quality Solutions
- High Speed Top View 12Mpix Camera with Telecentric Lens
- Latest 3D Programmable DLP Projectors (25mm max Height Inspection)
- Omron’s Unique Color-Highlight Illumination Technology
- Single / Dual Lane and Pre / Post Reflow configurations
- Real 3D Image Technology for Component and High-Quality Solder Joint Inspection
- Real-time Interactive 3D data feedback to the Programmer
- View and edit samples of all parts on the board simultaneously (in real-time)
- Process histograms are created automatically for all inspection tests and components
- AI self-optimization tools can perform automated inspection logic and criteria changes
- Real defect images can be stored in the library and used to improve the tuning process
- Consistent and quantitative inspection tests and logic across all component types
- Full 3D Data Processing and realization of Industrial 4.0 Smart Factory Solution
- Industrial 4.0 connectivity with The Hermes Standard for Full M2M Connectivity.
- Omron Q-upNavi: Combine SPI, AOI, and AXI Inspection Result Data for True Root-Cause Process Analysis for Process Improvement.
- Omron Q-upAuto: Advanced Manufacturing Analysis Combining Q-upNavi ‘Inspection Result Data’, with ‘Manufacturing Process Data’ for High-Level Process Improvement.
- VT-S530 is the latest 3D-AOI technology providing versatility for the Highest Value Quality Solutions, combining Highest Capability and Speed on the market, for tomorrow's production environments.
Specifications:
| Dimensions | 1180(W)×1640 (D)×1500(H) mm | |
| Weight | Approx. 850kg | |
|
Power supply |
Voltage |
200 - 240VAC (single phase), voltage fluctuation range ±10% |
| Normal rated power | 2.0kVA | |
| Line height | 900±20mm | |
| Air supply pressure | 0.3 - 0.6MPa | |
| Operating temperature range | 10 - 35°C | |
| Operating humidity range | 35 - 80%RH (Non-condensing) | |
|
Image signal input block |
Imaging system | 12M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
| Image resolution | 10μm/15μm | |
|
FOV |
10μ: 40×30mm | |
| 15μ: 60×45mm | ||
| Functional specifications | Supported PCB size (min.) | 50(W)×50(D)mm |
|
Supported PCB size (max.) |
Dual lane: 510(W)×330(D)mm | |
| Single lane: 510(W)×680(D)mm | ||
| Clearance | Above: 50mm; Below: 50mm | |
| Height measurement range | 25mm | |
| Thickness | 0.4 - 4mm | |
|
Inspection item |
Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge | |
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