Inline Laser PCB Depaneling Machine FR4 for unfired ceramics
Inline Laser PCB Depaneling Machine For SMT Manufacturing Line
Instruction:
PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics and medical device manufacturers require close tolerances and minimal debris—this is where laser technology shines
Typical UV Laser Applications:
- Depaneling flex and rigid PCBs
- Cover layer cutting
- Cutting fired and unfired ceramics
- Microvia drilling
- Skiving (cover layer removal)
- Pocket creation
- Metal ablation (for circuit board creation)
Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 460mmx460mm(Customizable) |
| Scanning Speed | 2500mm/s (max) |
| Working field | 40mmх40mm |
Clean and Precise Cutting:
Lasers make clean, burr-free and precise cuts against the edge of circuits and other important components—improving overall design flexibility without damaging the substrate. Because you don’t have to reorder parts or sharpen bits and blade, laser systems are also more cost effective.
Machine Details:
Our Service:
1. Lifetime technical support and 2 years warranty.
2. Free replacement or refund would be done in case of any quality problem.
3. Fast response/feedback within 12 hours
4. Engineers are available to be sent to do oversea installation and training.
5. Solid packaging to prevent damage from transportation.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.