110V Pulse Heat Bonding Machine for FFC to PCB Soldering with 200×170mm Work Area and 0.2mm Pitch Precision
Price:
USD1-10000/Set
MOQ:
1 set
Delivery Time:
5-8 days
Brand:
Winsmart
Product Description
Working Principle
The pulse heat bonding machine utilizes a hot bar power supply to deliver current to the thermode, which is made of high-resistivity materials such as tungsten, molybdenum, or titanium. The temperature rises to a specific value to melt the tin solder, and when it cools, the workpieces are securely connected. Pressure is maintained throughout the process, with temperature precisely controlled by an IGBT inverter power supply.
Key Features
- Adjustable temperature settings for different product requirements
- Unique thermode head material ensures uniform pressure distribution
- Integrated vacuum function for easier adjustment and positioning
- NC temperature control with high precision and clarity
- Digital pressure gauge with preset pressure range (1-20Kg)
- Microcomputer control for high accuracy and stability
- Programmable temperature curves including pre-heating and reflow soldering
- Suitable for high-density TAB, TCP, FPC, FFC, and PCB soldering applications
- Precise PID control with phase angle replacement for pulse drive
- Minimal vibration and noise with voltage fluctuation protection
- Real-time temperature curve and data display
- Touch screen interface for simplified operation
Applications
Ideal for various high-density TAB, TCP crimping applications, and FPC, FFC, and PCB solder crimping processes.
Technical Specifications
| Parameter | Specification |
|---|---|
| Machine Size | 590×640×620mm |
| Working Area | Max 200×170mm |
| Machine Weight | 89Kg |
| Working Air Pressure | 0.6-0.8Mpa |
| Thermode Head Size | Max 40×3mm |
| Welding Precision | Pitch 0.2mm |
| Pressing Time | 1-99.9s |
| Temperature Settings | RT-500℃ (±5℃ tolerance) |
| Welding Pressure | 1-20Kg |
| Working Environment | 10-60℃, 40%-95% humidity |
| Power Supply | AC220V±10% 50HZ, 2200W |
| Alignment Mode | CCD + LCD Monitor |
| Rotation Platform Tolerance | <0.02mm |
Frequently Asked Questions
What is the cycle time for soldering?
5-15 seconds per cycle.
Are there any special requirements for operation?
Solder paste must be applied to the pads before soldering.
What is the minimum pin pitch capability?
0.15mm minimum pin pitch.
What material is used for the thermode head?
Molybdenum alloy construction.
How should the thermode head be maintained?
Clean the thermode head daily and ensure flatness using a grinder.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Winsmart Electronic Co.,Ltd
Location
Liwu Industrial Park, Yuanzhou Town, Boluo County, Huizhou City, Guangdong Provice, China.
Contact Person
Amy