UV Laser PCB Depaneling Machine with 355nm Wavelength and 600mm x 600mm Working Field for Circuit Board Separation
MOQ:
1 set
Delivery Time:
5-30 days
Brand:
Winsmart
Product Description
UV Laser PCB Depaneling System
Advanced non-contact laser cutting technology for precision circuit board separation with minimal mechanical stress and superior cut quality.
Technology Overview
This UV laser depaneling system utilizes 355nm wavelength diode-pumped laser technology for high-precision circuit board separation. The laser beam achieves cut widths under 25μm and is controlled by precision mirror systems for exceptional accuracy.
Key Advantages
- Zero mechanical stress on components and boards
- Eliminates tooling costs and consumables
- Superior cut quality with precision edge definition
- Flexible design adaptation through software modifications
- Compatible with diverse materials including Teflon, ceramic, aluminum, brass, and copper
- Fiducial recognition ensures precise, clean cutting paths
Technical Specifications
| Parameter | Specification |
|---|---|
| Laser Type | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision | ±2μm |
| Repetition Precision | ±1μm |
| Effective Working Field | 600mm x 600mm (Customizable) |
| Scanning Speed | Up to 2500mm/s maximum |
| Working Field | 40mm x 40mm |
Application Benefits
This laser depaneling solution provides manufacturers with exceptional cutting precision, reduced operational costs, and versatile material compatibility. The non-contact process eliminates mechanical wear and tear while maintaining consistent high-quality results across various PCB designs and materials.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Winsmart Electronic Co.,Ltd
Location
Liwu Industrial Park, Yuanzhou Town, Boluo County, Huizhou City, Guangdong Provice, China.
Contact Person
Amy