This semi-automatic hot bar soldering machine features precise temperature display and control capabilities. The pulse hot press welding technology enables reliable bonding of flexible printed circuits (FPC) to PCBs with exceptional precision.

The hot bar soldering process begins with solder paste application on PCB pads, followed by reflow oven pre-soldering. The FPC is then positioned on the circuit board, and the heated molybdenum alloy indenter melts the solder to create secure electronic connections between components.

• Customizable heating rates for diverse product requirements
• Molybdenum alloy soldering head ensures temperature stability and extended service life
• Adjustable soldering head leveling for uniform assembly processing
• Digital temperature display with clear control interface
• Digital pressure meter with preset pressure range capability
• Specialized welding materials for optimal performance
• Precise PID control with phase angle drive system
• Minimal vibration and noise operation with stable voltage
• Enhanced heat transfer coefficient with wear-resistant construction

Ideal for bonding diverse components including flexible circuits, ribbon cables, wires, flex-to-PCB connections, flex-to-LCD assemblies, and thermo compression bonding of gold ribbon. Widely used in telecommunications, computer systems, automotive electronics, display technologies, and various industrial sectors.

LCD Modules, Solar Batteries, Camera Systems, Electronic Components, Coils/Inductors, Mobile Devices, Printed Wiring Boards, Power Devices, and applications requiring heating, fusing, joining, or forming operations.