Non Contact Flex Printed Circuit Board UV Laser Cutting Machine

UV Laser Cutting Machine Breakthrough:

FPC undertakes the link carrier of electronic components and is widely used in mobile electronic products, liquid crystal screens, medical treatment, aerospace and other fields. Its lightness, bendability and wear resistance make it active in various fields for a long time. However, any product has to go through the period of beginning, development, climax, decline and elimination. FPC products are in the region between climax and decline. Before there is no product to replace flexible board, if flexible board wants to continue to occupy market share, it must innovate.

FPC product innovation needs to be improved in terms of thickness, folding resistance, process level and price.

Thickness: it needs to be more flexible and thinner; Folding resistance: it needs to withstand more than 10000 folds and bends, and better base materials are needed; Process level: improve the process requirements of minimum spacing, minimum linewidth and minimum hole spacing to meet the needs of large-scale circuits; Price: control the cost, open up wider application channels and open up new market applications.

UV Laser Cutting Machine Function:

One of the methods gaining in popularity for singulation industry assembly is through the use of UV laser depaneling. This method has the advantage of speed, positional accuracy, no tooling wear and lastly no induced mechanical stresses on components during the singulating process.

UV Laser Cutting Machine Features:

1. No mechanical stress

2. Lower tooling costs

3. Higher quality of cuts, smooth cutting edge

4. No consumables

5. Design versatility-simple software changes enable application changes 

UV Laser Cutting Machine Specification: