GIS Laser DPX230 Laser Direct Imaging Machine with 20μm Alignment Accuracy and 25/25μm Line Width for PCB Manufacturing
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
GIS Laser
Product Description
GIS Laser DPX230 Laser Direct Imaging Machine
Advanced laser printing equipment with 20μm inner alignment accuracy and 25/25μm line width/spacing for precision PCB manufacturing applications.
Key Features
- Laser Direct Imaging (LDI) system with 405nm laser technology
- 20μm inner alignment accuracy for superior precision
- 25/25μm line width and line spacing capability
- Supports board thickness from 0.05mm to 7mm
- Multiple scale modes: Fixed, Auto, Interval, and Partition Alignment
- File format compatibility: Gerber274x and ODB++
- Full table splicing exposure support
- Text and serial number traceability features
Technical Specifications
| Parameter | Specification |
|---|---|
| Model Number | DPX230 |
| Laser Power | 405nm / 25-50W (optional) |
| Inner Alignment Accuracy | 20μm |
| Line Width/Spacing | 25/25μm |
| Board Thickness Range | 0.05-7mm |
| Line Width Tolerance | ±10% |
| Applicable Processes | Inner, Outer, Ceramic Substrate |
| File Formats | Gerber274x, ODB++ |
| Scale Modes | Fixed Scale, Auto Scale, Interval Scale, Partition Alignment |
| High Sensing Dry Film | 35s@24"x18" |
Applications
Ideal for high-precision manufacturing in PCB (Printed Circuit Board), HDI (High Density Interconnect), and FPC (Flexible Printed Circuit) applications. Suitable for inner layer, outer layer, and ceramic substrate processes requiring exceptional accuracy and reliability.
Customization & Support
- Brand: GIS Laser
- Manufacturing Origin: Suzhou, China
- Comprehensive technical support including installation, maintenance, and troubleshooting
- Software and firmware upgrade services
- Parts replacement and repair services
Frequently Asked Questions
What is a Laser Direct Imaging Machine?
Advanced imaging technology using laser beams to directly transfer patterns onto materials such as PCB boards with high precision and minimal distortion.
What materials can be processed?
PCB boards, glass, plastic, and other materials suitable for laser imaging applications.
What are the key advantages?
High-precision imaging with 20μm alignment accuracy, low heat transfer, minimal distortion, and fast throughput for efficient production.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian