GIS DPX820SM Laser Direct Imaging PCB with 620x720mm Exposure Area and 0.5-3.5mm Board Thickness for HDI and FPC Applications
GIS DPX820SM Laser Direct Imaging PCB utilizes advanced laser imaging technology for high-precision printed circuit board production. This system eliminates the need for phototooling while delivering exceptional accuracy and cost-effectiveness for PCB manufacturing applications.
| Parameter | Specification |
|---|---|
| Effective Exposure Area | 620×720mm (24"×28.5") |
| Board Thickness Range | 0.5–3.5mm |
| Line Width Tolerance | ±10% |
| Solder Bridge/Opening | 50/75μm (process condition) |
| Alignment Method | PAD (diameter: 0.5–3.0mm) |
| Laser Power | Mixing Wave Total Power 512W |
| Solder Mask Color Options | Fixed Scale / Auto Scale / Interval Scale / Partition Alignment |
- High-precision laser direct imaging technology
- Eliminates phototooling requirements
- Multiple solder mask color alignment options
- Wide board thickness compatibility (0.5–3.5mm)
- Support for various file formats
- Applicable for Solder Mask and Outer processes
This Laser Direct Imaging PCB system is engineered for high-precision applications including standard PCBs, High Density Interconnect (HDI) boards, and Flexible Printed Circuits (FPC). The precision PAD alignment method ensures accurate registration across various project requirements.
The GIS DPX820SM is manufactured in Suzhou, China, with alignment accuracy of ±12μm. The system processes materials including FR4, polyimide, aluminum, and copper substrates.
All PCBs are securely packaged in anti-static bags within protective boxes, reinforced with bubble wrap. Shipments are handled through reputable courier services with tracking numbers provided for all orders.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.