Jiangsu GIS Laser Technologies Inc.,
                                                                                                           
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Laser Direct Imaging PCB with 50/75μm Solder Bridge & 620x720mm Exposure Area for HDI/FPC Applications

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Brand: GIS
Product Description
Product Overview

Laser Direct Imaging PCB with 50/75μm solder bridge/opening process delivers high-precision circuit pattern transfer using advanced laser imaging technology. This industrial-grade solution offers exceptional accuracy and reliability for demanding PCB manufacturing applications.

Key Features
  • Advanced laser direct imaging technology for precise circuit pattern transfer
  • Fine 50/75μm solder bridge and opening capability
  • Large effective exposure area of 620×720mm (24"×28.5")
  • Multiple solder mask color options with flexible scaling modes
  • Robust construction with board thickness range from 0.5mm to 3.5mm
  • High alignment accuracy of ±12μm for superior precision
Technical Specifications
Parameter Specification
Effective Exposure Area 620×720mm (24"×28.5")
Solder Bridge/Opening 50/75μm (process condition)
Board Thickness 0.5-3.5mm
Alignment Accuracy ±12μm
Line Width Tolerance ±10%
Laser Power Mixing Wave Total Power 512W
Solder Mask Ink 30s@600×500mm (24"×20")
Scale Mode Options Fixed Scale, Auto Scale, Interval Scale, Partition Alignment
Applications PCB, HDI, FPC
Applications

This Laser Direct Imaging PCB solution is engineered for high-end applications across multiple industries including automotive electronics, medical devices, industrial equipment, and consumer electronics. The GIS DPX820SM model provides superior performance for demanding circuit board manufacturing requirements.

Customization & Support

Available with multiple scale mode options including White, Black, and Yellow solder mask colors. Custom configurations supported for specific application requirements with comprehensive technical assistance.

Packaging & Shipping

Products are securely packaged using shock-resistant and moisture-proof materials including high-quality carton boxes and bubble wrap. Shipping options include air freight, land transportation, and sea transportation based on customer requirements.

Frequently Asked Questions
What is Laser Direct Imaging PCB?
Laser Direct Imaging PCB (GIS DPX820SM) uses laser beam technology to directly etch circuit patterns onto PCBs without requiring phototools, enabling higher precision and efficiency.
What are the key advantages of this technology?
This technology offers superior accuracy with ±12μm alignment, faster production cycles, higher yield rates, and enhanced reliability for complex circuit designs.
What materials are compatible with this process?
Compatible with various conductive materials including copper, aluminum, and other metals used in PCB manufacturing.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Jiangsu GIS Laser Technologies Inc.,
Location Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person Tian

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