GIS Laser DPX220 20μm Laser Direct Imaging Machine with 610x710mm Exposure Area for PCB/HDI/FPC Manufacturing
Price:
Negotiable
MOQ:
1
Delivery Time:
Negotiable
Brand:
GIS Laser
Product Description
Precision Laser Direct Imaging System
Advanced LDI Technology
GIS Laser's DPX220 Laser Direct Imaging Machine utilizes innovative DPX220 laser digital imaging technology, eliminating traditional film or mask exposure methods for superior precision, stability, and manufacturing efficiency.
Key Specifications
| Parameter | Specification |
|---|---|
| Effective Exposure Area | 610mm × 710mm |
| Board Thickness Range | 0.05mm to 7mm |
| Inner Alignment Accuracy | 20μm |
| Outer Alignment Accuracy | ±10μm |
| Line Width/Spacing | 20/20μm |
| Laser Power | 405nm / 25-50W (optional) |
| Exposure Time | 35 seconds for 24"×18" dry film |
Technical Features
Advanced UV-Mark alignment method for precision positioning
Multiple scale modes: fixed scale, auto-scale, interval scale, and partition alignment
Comprehensive file format support including Gerber274x and ODB++
Integrated MES functionality for board numbering and traceable information
Supports text and serial number integration for production tracking
Applications
Designed for PCB, HDI, FPC, and ceramic substrate manufacturing processes, supporting inner layer, outer layer, and ceramic substrate exposure applications.
Manufacturing Details
Brand: GIS Laser
Model: DPX220
Origin: Suzhou, China
Line Width Tolerance: ±10%
Support & Services
Comprehensive technical support including on-site installation, maintenance services, remote technical assistance, and periodic calibration to ensure optimal machine performance.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian