Jiangsu GIS Laser Technologies Inc.,
                                                                                                           
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RTR315 LDI Machine with 15μm Resolution and ±24μm Inner Layer Alignment for PCB Manufacturing

Price Negotiable
Price: negotiable price
MOQ: 1 set
Delivery Time: 20 work days
Brand: GIS
Product Description
LDI Machine Overview
Our laser direct imaging (LDI) system solutions provide advanced imaging capabilities for PCB manufacturing, offering superior accuracy and efficiency for flexible board applications.
Technical Advantages
Early adopters of LDI technology typically include fast-cycle, prototype, and high-capacity PCB manufacturers requiring rapid and accurate prototype preparation. These systems deliver significant time savings, eliminate mask film costs, and provide exceptional flexibility and precision.
While mass production manufacturers initially hesitated due to speed limitations and operational costs, recent technological advancements have made LDI viable for high-volume manufacturing environments.
How Laser Direct Imaging Works
The LDI process involves positioning a PCB with a photo-sensitive surface under a computer-controlled laser. The computer scans the board surface into a raster image, matches it to pre-loaded CAD/CAM design files, and uses the laser to directly create the required image on the board.
Technical Specifications
Specification RTR315 Model
Application PCB, HDI, FPC (inner layer, outer layer, anti-welding)
Resolution (mass production) 15μm
Capacity 12S@18"×24"
Exposure Size 260×800mm
Panel Thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment Capability Outer layer ±12μm; Inner layer ±24μm
Line Width Tolerance ±10%
Deviation Adjustment Fixed increase/contraction, automatic increase/contraction, interval increase/contraction, partition alignment
Laser Type LD Laser, 405±5nm
File Format Gerber 274X; ODB++
Power Requirements 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation +7% to -10%
Operating Environment Yellow light room; Temperature 22°C ±1°C; Humidity 50% ±5%; Cleanliness level 10000+
Vibration Requirements Avoid violent vibration near equipment
About Our Company
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions. Our product portfolio ranges from LDI configurations for high-mix and emerging PCB niche applications to fully automated LDI solutions for mass production environments.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Jiangsu GIS Laser Technologies Inc.,
Location Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person Tian

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