ISO 9001 LDI Laser Direct Imaging System for PCB HDI FPC with 30μm Resolution and 610×710mm Exposure Size
Advanced LDI system solutions designed for various PCB applications including HDI and FPC manufacturing, featuring high-precision imaging capabilities.
- Eliminates traditional mask processes for improved efficiency
- Reduces time and costs associated with mask loading and unloading
- Minimizes deviation caused by mask expansion and contraction
- Delivers high image resolution and superior production yield
| Specification/Model | DPX230 |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 30μm |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type | LD Laser, 405±5nm |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz |
| Operating Environment | Yellow light room; Temperature 22°C±1°C; Humidity 50%±5% |
The laser direct imaging process utilizes a computer-controlled laser to create precise images directly onto photo-sensitive PCB surfaces. The system scans the board surface into a raster image and matches it with pre-loaded CAD or CAM design files, enabling direct image creation without physical masks.
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions. Our product portfolio ranges from LDI configurations for high-mix and emerging PCB applications to fully automated LDI systems for mass production environments.
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