610mm x 710mm Laser Direct Imaging Equipment with 30μm Resolution for HDI PCB Manufacturing
Advanced PCB manufacturing solution for high-density interconnect (HDI) boards, flexible printed circuits (FPC), and complex PCB technologies with precision laser exposure technology.
Laser Direct Imaging (LDI) revolutionizes PCB fabrication by using computer-controlled laser beams to directly expose circuit traces onto photo-sensitive boards, eliminating the need for traditional photo tools and enabling superior precision and efficiency.
The system positions a PCB with a photo-sensitive surface under a computer-controlled laser. The computer scans the board surface, matches it to pre-loaded CAD/CAM design files, and uses the laser to digitally create the precise circuit image directly on the board.
| Specification | Details |
|---|---|
| Model | DPX230 |
| Applications | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 30μm |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610mm × 710mm |
| Panel Thickness Range | 0.05mm - 3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer: ±12μm; Inner layer: ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type | LD Laser, 405±5nm |
| File Format Support | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz |
| Operating Environment | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000+ |
- Enhanced manufacturing efficiency and production accuracy
- Reduced labor costs and minimized human errors
- Advanced alignment capabilities for precision PCB fabrication
- Multiple deviation control modes for flexible production
- Ideal for high-end PCB applications including HDI, RF, and embedded technologies
We provide comprehensive PCB laser direct imaging system solutions ranging from configurations for high-mix and emerging niche applications to fully automated systems for mass production environments.
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