2540dpi Laser Direct Imaging Machine 1200x1300mm with 4KW Power and ISO 9001 Certification
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging Machine Overview
This 2540dpi ISO 9001 certified Laser Direct Imaging (LDI) machine with 1200x1300mm exposure area eliminates traditional photo-tool requirements, providing superior precision for PCB manufacturing and 3D glass cover panel applications.
Key Advantages
- Eliminates alignment issues and light refraction problems associated with photo-tools
- Automatically compensates for material distortion through enhanced optical alignment
- Enables rapid design changes by updating digital files rather than creating new photo-tools
- Reduces production costs and improves consistency in circuit trace creation
3D Cover Glass Automation Line
Complete automation solution for BM patterning on 3D glass panels used in smartphones and wearable devices.
- Fully automated process from loading to unloading with plasma cleaning, spraying, and developing
- Achieves up to 30μm resolution with over 95% yield rate
- Thinner BM layer for easier assembly and superior pattern quality
Technical Specifications
| Specification/Model | GD-200 |
|---|---|
| Dimensions (mm) | 3850×1350×1800 (customizable) |
| Weight | 3000 KG |
| Maximum Power | 4 KW |
| Maximum Exposure Area | 1500×600×200mm (customizable) |
| Laser Source | 375nm±10nm, 405nm±10nm |
| Laser Output Power | 375-12W (±3%), 405-5W (±3%) |
| Laser Transmission | Optical Fiber |
| Lens Magnification | 1.95× / 3.95× |
| Resolution | 12700 dpi |
| Spot Size | 40×7mm |
| Hardware Repeatability | ±5μm |
| Photosensitive Material | Photoresist |
| Input Document Format | Gerber274x |
Specifications subject to change without notice
Company Background
GIS Intelligent Inc., a subsidiary of GIS Tech Inc., specializes in advanced solutions for lithium battery fabrication and 3D cover glass patterning. Founded in 2015 by U.S. professionals in Suzhou, China, we develop Digital Lighting Processing (DLP) technology for various industrial patterning applications.
Our core team brings over 20 years of semiconductor technology experience from top international companies, enabling us to deliver cutting-edge solutions for MEMS, glass, PCB, and screen printing manufacturers.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian