380V Three Phase LDI Laser Direct Imaging Equipment with 30μm Resolution and 610×710mm Exposure Size for PCB Manufacturing
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Advanced 380V Three Phase LDI Laser Direct Imaging System
Our comprehensive laser direct imaging (LDI) system solutions are engineered for various PCB multilayer applications, addressing the increasing technical demands of modern PCB manufacturing.
Technology Transition to Direct Imaging
Advanced PCB designs featuring thinner materials, complex structures, and fine design rule tolerances have exposed limitations in conventional mask contact lithography. This has driven the industry shift toward maskless direct imaging technology, where computer-controlled lasers directly expose patterns on photoresist-coated panels or liquid solder mask layers.
Key Advantages of Direct Imaging Technology
- Superior registration accuracy and printing line uniformity
- Enhanced depth-of-focus capabilities
- Complete product and process traceability with data interfaces
- Increased productivity and quality levels with higher throughput and yields
- Reduced process costs and total cost of ownership compared to conventional mask lithography
Laser Direct Imaging Process Overview
In PCB fabrication, circuit traces are defined through the imaging process. Laser direct imaging exposes traces directly using a highly focused, numerically controlled laser beam, eliminating the need for photo tools and flooded light exposure.
How LDI Technology Works
The system positions a PCB with a photosensitive surface beneath a computer-controlled laser. The computer generates the circuit pattern by scanning the board surface as a raster image, matching it to pre-loaded CAD/CAM design files, and directly creating the image using laser exposure.
Technical Specifications - Model DPX230
| Specification/Model | DPX230 |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (mass production) | 30μm |
| Capacity | 30-40S@18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz |
| Operating Environment | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above |
About Our Company
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions. Our product portfolio spans from LDI configurations for high-mix and emerging PCB niche applications to fully automated LDI systems for mass production environments.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian