RTR315 Roll-to-Roll PCB Laser Direct Imaging System with 15μm Resolution and 260×800mm Exposure Size
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging System for PCB Manufacturing
Advanced LDI Technology Overview
The RTR315 Laser Direct Imaging (LDI) system represents cutting-edge technology for PCB exposure processes. Unlike traditional negative contact exposure methods, this system eliminates the need for physical negatives by utilizing high-energy laser beams to directly transfer circuit patterns onto copper-clad laminates coated with photoimaging agents.
How LDI Technology Works
During circuit board fabrication, the LDI system exposes circuit traces directly using a computer-controlled, highly focused laser beam. The process involves scanning the board surface to create a raster image that matches pre-loaded CAD or CAM design files, enabling precise digital image creation without photo tools.
Technical Specifications
| Specification/Model | RTR315 |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 15μm |
| Capacity | 12S@18"×24" |
| Exposure Size | 260×800mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Deviation Adjustment Modes | Fixed increase/contraction, automatic increase/contraction, interval increase/contraction, partition alignment |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50HZ, voltage fluctuation range +7% ~ -10% |
| Operating Environment | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above |
| Vibration Requirements | Avoid violent vibration near equipment |
Key System Advantages
- Eliminates traditional phototool requirements and associated costs
- High-precision 15μm resolution for fine-line circuitry
- Advanced alignment capabilities with ±12μm outer layer and ±24μm inner layer precision
- Multiple deviation adjustment modes for flexible production requirements
- Suitable for various PCB types including HDI and flexible circuits
- Roll-to-roll configuration for continuous processing efficiency
Our company specializes in providing innovative PCB laser direct imaging system solutions, ranging from configurations for high-mix and emerging niche applications to fully automated systems for mass production environments.
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Get in Touch
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Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian