LDI Roll to Roll Direct Imaging PCB System 380V Three Phase - 15μm Resolution, 260×800mm Exposure
Advanced laser direct imaging (LDI) system designed for PCB manufacturing, featuring roll-to-roll processing capabilities and 380V three-phase power operation.
- Eliminates traditional mask processes
- Reduces time and cost associated with mask loading/unloading
- Minimizes deviation from mask expansion and contraction
- Delivers high image resolution and production yield
| Specification | RTR315 Model Details |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 15μm |
| Capacity | 12S@18"×24" |
| Exposure Size | 260×800mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type | LD Laser, 405±5nm |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation +7% to -10% |
| Operating Environment | Yellow light room; Temperature 22°C ±1°C; Humidity 50% ±5%; Cleanliness level 10,000+ |
LDI technology exposes circuit traces directly using a computer-controlled laser beam instead of traditional flood lighting through photo tools. The system scans the board surface into a raster image, matches it with pre-loaded CAD/CAM design files, and digitally creates the required image on the PCB surface.
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions, offering configurations ranging from high-mix and niche applications to fully automated mass production environments.
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