The Semiconductor Packaging film is a release film that uses ultra-high-quality fluoride as the base material for tape casting. It has the characteristics of low surface energy, high melting point, high strength, and high elongation.

It is suitable for the release of plastic packaging in the semiconductor and LED industries, and solves the problems of knife marks, pitting, and frame overflow on the surface of plastic packaging products.

Semiconductor Packaging film Features

· Excellent release ability for different material surfaces;
· High tensile strength and high elongation at high temperature, supporting the precise conformation of complex molds with large height differences;
The melting point is 260°C, and it can work at 160°C for a long time;
· Glossy and matte surfaces are optional to support different final product surface requirements;
· Solve the overflow problem during the plastic sealing process.