UV De-bonding Film -UV392E
Product Description
UV392E is a single-sided UV de-bonding film with high initial adhesion. After UV irradiation, the adhesive surface adhesion is greatly reduced, allowing easy peeling.
Product Structure
Product Features
· Excellent reliability
· High instant bond strength; after UV de-bonding, components are easily removed without adhesive residue
· Compliant with RoHS requirements
Product Application
This product is applicable for cutting and positioning protection of various silicon wafers, glass, ceramic capacitors, and PCB boards.
Performance Parameters
| Test Item | Sub-item | Standard Value | Test Method |
| Substrate Thickness (μm) | 150 ± 5 | Micrometer | |
| Product Thickness (excl. liner) (μm) | 162 ± 5 | Micrometer | |
| 180° Peel Force (gf/25mm) | Before UV Irradiation | 1200 ± 200 | Per GBT 2792-2014 |
| After UV Irradiation | < 10 | ||
| Tensile Strength (MPa) | Transverse Direction | > 18 | Per GBT 30776-2014 |
| Longitudinal Direction | > 18 | ||
| Elongation (%) | Transverse Direction | > 500 | Per GBT 30776-2014 |
| Longitudinal Direction | > 500 |
*. UV Irradiation Conditions: UV irradiation energy: 500–600 mJ/cm², main wavelength: 365 nm
Storage Method
Storage conditions: 10–30 °C, relative humidity 40–70%, in a dark and light-proof environment.
Shelf life: 6 months.
Precautions
1. Keep the product away from heat sources and open flames;
2. The surface of the substrate should be clean, dry, and free of grease or other contaminants;
3. The product must not be used outdoors. Outdoor weather conditions may affect tape performance and cause adhesive residue on the substrate.
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