Product Description

IH810F is a polyimide (PI) protective film using an organosilicon pressure-sensitive adhesive. It offers excellent adhesion performance and outstanding high-temperature resistance, making it ideal for precision protection applications in demanding thermal processes.

Product Structure

Key Features

• Excellent high-temperature resistance — no adhesive residue after removal

• High instantaneous bond strength with superior sealing performance

• RoHS compliant.

Applications

IH810F is designed for high-temperature masking protection in various encapsulation processes, temporary fixation during high-temperature manufacturing, carrier support and substrate protection during transfer operations, and surface protection where residue-free removal after high-temperature exposure is required.

Technical Specifications

Storage Conditions

Storage Environment: Keep in original packaging. Store in a cool, dry environment away from direct sunlight, freezing temperatures, and excessive heat.

Shelf Life: 6 months when stored at temperature 15°C–30°C and relative humidity 40%–70%.

Precautions

• Keep the product away from heat sources and open flames.

• The surface to be bonded must be clean, dry, and free of oil or other contaminants.

• As a pressure-sensitive adhesive product, apply sufficient pressure during lamination. Inadequate pressure will adversely affect adhesion performance and appearance.

• Not intended for outdoor use. Outdoor exposure may cause adhesive residue on the substrate upon removal.