H Grade Polyimide Film Adhesive Tape 0.06mm Thickness with 280°C Temperature Resistance for Electrical Insulation
Price:
Usd1~5/roll
MOQ:
500m2
Delivery Time:
35 working days
Product Description
Product Overview
H Grade Polyimide Film Adhesive Tape with single-side silicone coating, designed for high-temperature applications requiring superior electrical insulation and thermal protection.
Material Composition
Base Film: Polyimide (PI) Film
Adhesive: Silicone Adhesive
Visual Characteristics
Amber transparent appearance with smooth surface, free from creases, bubbles, foreign objects. No tearing or adhesive transfer during unwinding.
Key Performance Features
- High mechanical strength with excellent electrical insulation properties
- Exceptional dimensional stability and temperature resistance
- Resistant to solvents and water exposure
- Long-term operating temperature: 220°C, short-term up to 280°C
Industrial Applications
- Electronic protection during bonding processes including SMT wave soldering and reflow soldering
- PCB board gold finger protection and high-temperature component shielding
- Coil insulation wrapping for H-class motors and transformers
- High-temperature coil end wrapping and thermal resistance protection
Technical Specifications
| Parameter | Type 2321 | Type 2321L |
|---|---|---|
| Total Thickness (mm) | 0.06 ± 0.003 | |
| Base Film Thickness (mm) | 0.025 ± 0.003 | |
| Breakdown Voltage (KV) | ≥5 | |
| Insulation Resistance (Ω) | ≥10¹³ | |
| Tensile Strength (N/10mm) | ≥40 | |
| Elongation (%) | ≥45 | |
| Adhesion to Steel (N/10mm) | ≥2.4 | |
| Working Temperature (°C) | -73 to 280 | |
| Chemical Resistance (20% HCL/NaOH 10Hrs) | Bonding maintained, no delamination or adhesive transfer | |
| Releasing Film | No | 0.075mm |
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Company
UN.Tex (Dalian) Co.,Ltd
Location
Softview Center Room A-705, No.1A-4 Softpark Road, Dalian, China 116023
Contact Person
Sophia Gao