Heat Insulation Polyimide Film Adhesive Tape 25μm Base Film 60μm Total Thickness for High-Temperature Electrical Applications

Price Negotiable

Price: Usd1~5/roll

MOQ: 500m2

Delivery Time: 35 working days

Product Description

Product Overview

High-performance heat insulation polyimide film adhesive tape available in 25μm and 60μm thicknesses, designed for demanding electrical insulation and thermal protection applications in industrial and electronic manufacturing.

Construction & Materials

Base Material

Polyimide (PI) Film - Amber transparent with smooth surface, free from creases, bubbles, foreign objects, and ensures no tearing or glue layer transfer during unwinding.

Adhesive System

Silicone adhesive formulation providing excellent bonding performance and thermal stability.

Key Characteristics

High mechanical strength and excellent electrical insulation properties
Exceptional dimensional stability and high temperature resistance
Resistant to solvents and water
Long-term working temperature: 220°C, short-term: 280°C

Technical Specifications

Parameter	Type 2321 / 2321L
Total Thickness	0.06mm ± 0.003mm
Base Film Thickness	0.025mm ± 0.003mm
Breakdown Voltage	≥5 kV
Insulation Resistance	≥10¹³ Ω
Tensile Strength	≥40 N/10mm
Elongation	≥45%
Adhesion Strength to Steel	≥2.4 N/10mm
Working Temperature Range	-73°C to 280°C
Chemical Resistance (20% HCL/NaOH, 10Hrs)	Bonding well, no delamination, no glue layer transfer
Releasing Film	Type 2321: None / Type 2321L: 0.075mm

Industrial Applications

Electronic Protection

SMT wave soldering and reflow soldering temperature protection
PCB board gold finger protection
SMD electronic transformers and relays
Electronic switches and components requiring high temperature and moisture protection

Electrical Insulation