Through Hole Assembly PCB Manufacturing POP Boards Pcb Assembly Peelable
Through Hole Assembly PCB Fabrication POP Boards High - Tg FR4 Peelable
PCB Manufacturing Description:
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Introduction:
Founded in 2011, Tongzhan is committed to becoming a leading one-stop EMS supplier. We focus on high-speed turnkey PCB services: PCB design, manufacturing, component procurement, PCBA, and supply chain services. Product solutions support flexible supply. The types of plates support rigid plates, flexible plates, and rigid-flexible plates. This product provides one-stop service from SMT, post welding, assembly to testing. We will pay more attention to innovation and devote ourselves to providing high-quality products.
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