Peelable PCB Fab And Assembly High Tg FR4 Printed Circuit Board Manufacturers
Through Hole Assembly PCB Fabrication POP Boards High - Tg FR4 Peelable
PCB Manufacturing Description:
1. Quick-turn and flexible delivery
2. Support a wide range of PCBs: high-layer, multi-layer, rigid-flex, high frequency, high speed, etc.
3. flexible boards, rigid-flex boards, multi-layer boards, blind-hole boards, and thick copper and aluminum boards.
4. Professional supplier positioning
5. Seamless link from prototype to mass production
6. Whole-flow quality assurance, IPC, Special industry inspection standard.
PCB Manufacturing Parameters:
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
PCB Manufacturing Introduction:
The PCB boards we produce include POP boards, ordinary boards, FPC boards, rigid-flex bonding boards, metal baseplates, etc. They are widely used in industrial control, medical care, automotive electronics, communications, and the Internet. The product is RoHS-compliant lead-free assembly/non-RoHS assembly. SMT, post welding, assembly to testing one-stop service supports flexible supply.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.