Carbon Ink FR4 Circuit Board HASL Peelable Electronic Pcb Assembly
FR4 Electronic Component Sourcing HASL Pb Free Immersion Gold Osp Peelable
Electronic Component Sourcing Description:
The PCB boards we produce include POP boards, ordinary boards, FPC boards, rigid-flex bonding boards, metal baseplates, etc. They are widely used in industrial control, medical care, automotive electronics, communications, and the Internet. The product is RoHS-compliant lead-free assembly/non-RoHS assembly. SMT, post welding, assembly to testing one-stop service supports flexible supply.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Electronic Component Sourcing Introduction:
1. High reliability
Through a series of technical means such as inspection, testing, and aging tests, the PCB can be guaranteed to work reliably for a long time (usually 20 years).
2. designability
Requirements for various properties of PCB (electrical, physical, chemical, mechanical, etc.) can be achieved through design standardization, normalization, etc. In this way, the design time is short and the efficiency is high.
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