Rogers Turnkey PCB Assembly Carbon Ink Multilayer Pcb Manufacturing Assemply
Turnkey PCB Assembly Carbon Ink Rogers Consumer Electronics Multi-Layer
Turnkey PCB Assembly Description:
1. Quick-turn and flexible delivery
2. Support a wide range of PCBs: high-layer, multi-layer, rigid-flex, high frequency, high speed, etc.
3. Professional supplier positioning.
4. Seamless link from prototype to mass production.
5. Whole-flow quality assurance, IPC, Special industry inspection standard.
Turnkey PCB Assembly Parameters:
|
Item |
Technical Parameter |
|
Layer |
2-64 |
|
Thickness |
0.3-6.5mm |
|
Copper Thickness |
0.3-12 oz |
|
Min Mechanical Hole |
0.1mm |
|
Min Laser Hole |
0.075mm |
|
HDI |
1+n+1,2+n+2,3+n+3 |
|
Max Aspect Ratio |
20:01 |
|
Max Board Size |
650mm*1130mm |
|
Min Width/Space |
2.4/2.4mil |
|
Min Outline Tolerance |
±0.1mm |
|
Impedance Tolerance |
±5% |
|
Min PP Thickness |
0.06mm |
|
Bow &Twist |
≤0.5% |
|
Materials |
FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
|
Surface Finished |
HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
|
Special Capability |
Gold Finger Plating, Peelable, Carbon ink |
Turnkey PCB Assembly Introduction:
1. designability
Requirements for various properties of PCB (electrical, physical, chemical, mechanical, etc.) can be achieved through design standardization, normalization, etc. In this way, the design time is short and the efficiency is high.
2. producibility
PCB adopts modern management, which can realize standardization, scale (quantization), and automatic production, so as to ensure the consistency of product quality.
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