Buried Blind Hole PCB Panel Design Thru Hole Assembly Simple Pcb Layout Design
Gold Finger Plating Buried Blind Hole PCB Board Design Thru-Hole Assembly
Prototype PCB Assembly Description:
1. Focus on high-speed and high-density PCB design.
2. Industry-leading SI/PI simulation.
3. Many years of experience.
Prototype PCB Assembly Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Prototype PCB Assembly Introduction:
1. Testability
A relatively complete test method and test standard have been established, and the qualification and service life of PCB products can be detected and identified through various test equipment and instruments.
2. Assemblability
PCB products not only facilitate the standardized assembly of various components but also enable automated and large-scale mass production. In addition, the overall assembly of the PCB and various other components can also form larger components, systems, and even complete machines.
3. Maintainability
Since the components of PCB products and various components are assembled in a standardized design and large-scale production, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, conveniently and flexibly, and the work of the system can be quickly restored.
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