Beijing Plink AI Technology Co., Ltd
                                                                                                           
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UVA V2X Construction Nvidia AGX Orin Compute Module 64GB

Price Negotiable
Price: USD1680-USD1700/PCS
MOQ: 1PCS
Delivery Time: 15-30 work days
Brand: NVIDIA
Product Description

UVA V2X Construction Nvidia AGX Orin Compute Module 64GB

 

 

NVIDIA Jetson AGX Orin Module (64G)

 

What Is Edge Computing?

At the edge, IoT and mobile devices use embedded processors to collect data. Edge computing takes the power of AI directly to those devices and processes the captured data at its source—instead of in the cloud or data center. This accelerates the AI pipeline to power real-time decision-making and software-defined autonomous machines.

 

 

 

AI is Now Everywhere

 

As businesses across industries grapple with vast amounts of data, more complex operations, and more dynamic markets, edge AI is playing a growing role in helping them rapidly respond. Through a combination of computing power, AI technology, data analytics, and advanced connectivity, the edge extends compute capabilities from data centers out to the edge of networks, allowing organizations to act quickly on data where it’s captured. Reducing the distance between where data is captured and where it’s processed not only alleviates data transit costs, but also improves latency, bandwidth utilization, and infrastructure costs.

 

Jetson AGX Orin Module (64GB) Technical Specifications

Brand NVIDIA
Module NVIDIA Jetson AGX Orin 64GB
AI Performance 275 TOPS
GPU 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores
GPU Max Frequency 1.3 GHz
CPU 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
3MB L2 + 6MB L3
CPU Max Frequency 2.2 GHz
DLA Max Frequency 1.6 GHz
DL Accelerator 2x NVDLA v2
Safety Cluster Engine -
Memory 64GB 256-bit LPDDR5
204.8GB/s
Storage 64GB eMMC 5.1
Display 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
Camera Up to 6 cameras (16 via virtual channels)
16 lanes MIPI CSI-2
D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)
Video Encode 2x 4K60 (H.265)​
4x 4K30 (H.265)​
8x 1080p60 (H.265)​
16x 1080p30 (H.265)​
Video Decode 1x 8K30 (H.265)​
3x 4K60 (H.265)​
7x 4K30 (H.265)​
11x 1080p60 (H.265)​
22x 1080p30 (H.265)​
PCIe Up to 2 x8 + 1 x4 + 2 x1
(PCIe Gen4, Root Port, & Endpoint)
Networking 1x GbE
1x 10GbE
Power 15W - 60W
Other I/O 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs
Mechanical 100mm x 87mm
699-pin Molex Mirror Mezz Connector
Integrated Thermal Transfer Plate


 

 


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A revolution in embedded AI product development.

The rapid evolution of artificial intelligence (AI) and the proliferation of billions of IoT devices are transforming almost every industry. AI at the edge now enables use cases that we could only imagine until recently. Today, the NVIDIA Jetson™ platform brings incredible new capabilities to the edge, accelerating product development and deployment at scale.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Plink AI Technology Co., Ltd
Location C1106,Jinyu Jiahua Building,Shangdi 3rd Street, Haidian District, Beijing 100085, P.R.China
Contact Person Cindy

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