Shenzhen Sky-Win Technology Co., Ltd
                                                                                                           
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11 Years
Since 2015
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Machinery Electronics Production Machinery

OEM SMT Green Soldermask Multilayer PCB Assembly Heavy Copper Printed Circuit Board

Price Negotiable
Price: $0.1- $4.9
MOQ: 100 piece
Delivery Time: 3-15days
Brand: Sky-Win Technology
Product Description

OEM SMT Green Soldermask Multilayer PCB Assembly Heavy Copper Printed Circuit Board
 
SkyWin SMT Assembly Capability
SkyWin provides a one-stop service from PCB production and component procurement to turnkey surface mount PCB assembly.
We have the capabilities to assemble SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single- or double-sided component insertions. Our production facilities can assemble the following SMT types:
Ball Grid Array (BGA)
Ultra-Fine Ball Grid Array (uBGA)
Quad Flat Pack No-Lead (QFN)
Quad Flat Package (QFP)
Small Outline Integrated Circuit (SOIC)
Plastic Leaded Chip Carrier (PLCC)
Package-On-Package (PoP)
Small Chip Packages (0.2mm pitch )
Main SMT Machines in PCBWay
Automatic Solder Paste Printer
Reflow Soldering Machine
Pick & Place Machine
Manufacturing Capabilities: PCB Assembly Manufacturer, Solder Paste Printing, Reflow Soldering, AOI, and X-ray Inspection
 
SMT PCB Assembly  Technical Parameters 

ItemsPCBA capacity
Product nameSMT circuit board manufacturer custom electronic assembly pcb pcba
Assembly detailsSMT and Thru-hole, ISO SMT and DIP lines
Testing on productsTesting jig/mold , X-ray Inspection, AOI Test, Functional test
QuantityMin quantity : 1pcs. Prototype, small order, mass order, all OK
Files neededPCB : Gerber files(CAM, PCB, PCBDOC)
Components : Bill of Materials(BOM list)
Assembly : Pick-N-Place file
PCB Panel SizeMin size : 0.25*0.25 inches(6*6mm)
Max size : 1200*600mm
Components detailsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine BGA Pitch to 0.2mm(8mil)
BGA Repair and Reball
Part Removal and Replacement
Component packageCut Tape, Tube, Reels, Loose Parts
PCB+ assembly processDrilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity

 
Lead Time For Multilayer PCB

Layers
Batch/Days
Sample/Days
Expedited/Days
Double-Layer
10
8
5
Four Layer
12
10
6
Six Layer
12
11

 

6
Eight Layer
14
12
7
Ten Layer
14
12
7
Twelve Layer
16
13
8
Fourteen Layer
16
13
10
Sixteen Layer
18
14
10
......
18
14
10

 
SMT Assembly Testing  And Inspection Capabilities
Sky Win makes it mandatory to perform visual inspections to see if there are any missing or misaligned components or issues with solder bridging. Besides manual reviews, we also use SMT inspection machines for this purpose.
Automated Optical Inspection
Solder Paste Inspection
First Article Inspection
X-ray Testing
In-circuit Testing
Functional Testing
 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Sky-Win Technology Co., Ltd
Location 4F&2F, Building 1st, Nanchang Huafeng Industrial Park,NanchangCommunity, Xixiang Town, Baoan District, Shenzhen, China
Contact Person Yang

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