Sanhuang electronics (Hong Kong) Co., Limited
                                                                                                           
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W631GG6KB-12 IC DRAM 1GBIT PARALLEL 96WBGA Winbond Electronics

Price Negotiable
Price: Based on current price
MOQ: 1
Delivery Time: 3-5 work days
Brand: Winbond Electronics
Product Description

Product Details

 

GENERAL DESCRIPTION

The W631GG6KB is a 1G bits DDR3 SDRAM, organized as 8,388,608 words x 8 banks x 16 bits. This device achieves high speed transfer rates up to 1866 Mb/sec/pin (DDR3-1866) for various applications. W631GG6KB is sorted into the following speed grades: -11, -12, 12I, 12A, 12K -15, 15I, 15A and 15K. The -11 speed grade is compliant to the DDR3-1866 (13-13-13) specification. The -12, 12I, 12A and 12K speed grades are compliant to the DDR3-1600 (11-11-11) specification (the 12I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C). The -15, 15I, 15A and 15K speed grades are compliant to the DDR3-1333 (9-9-9) specification (the 15I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C).

 

 

FEATURES

 Power Supply: VDD, VDDQ = 1.5V ± 0.075V
 Double Data Rate architecture: two data transfers per clock cycle
 Eight internal banks for concurrent operation
 8 bit prefetch architecture
 CAS Latency: 6, 7, 8, 9, 10, 11 and 13
 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable On The-Fly (OTF)
 Programmable read burst ordering: interleaved or nibble sequential
 Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received with data
 Edge-aligned with read data and center-aligned with write data
 DLL aligns DQ and DQS transitions with clock
 Differential clock inputs (CK and CK#)
 Commands entered on each positive CK edge, data and data mask are referenced to both edges of a differential data strobe pair (double data rate)
 Posted CAS with programmable additive latency (AL = 0, CL - 1 and CL - 2) for improved command, address and data bus efficiency
 Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
 Auto-precharge operation for read and write bursts
 Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)
 Precharged Power Down and Active Power Down

 

Specifications

Attribute Attribute Value
Manufacturer Winbond Electronics
Product Category Memory ICs
Categories Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Manufacturer Hirose Electric Co Ltd
Series IT1
Packaging Tray
Part-Status Active
Connector-Type Module, Center Strip Contacts
Number-of-Positions 252 Positions
Pitch 0.020" (0.50mm)
Number-of-Rows 2 Rows
Mounting-Type -
Features Double Sided
Contact-Finish Gold
Contact-Finish-Thickness -
Mated-Stacking-Heights -
Height-Above-Board -

Descriptions

SDRAM - DDR3 Memory IC 1Gb (64M x 16) Parallel 800MHz 20ns 96-WBGA (9x13)
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Sanhuang electronics (Hong Kong) Co., Limited
Location No. 2520, 25th Floor, Block A, New Asia Guoli Building, Huaqiang North Street, Shenzhen, China
Contact Person Zhao

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