W631GG6KB-12 IC DRAM 1GBIT PARALLEL 96WBGA Winbond Electronics
Price:
Based on current price
MOQ:
1
Delivery Time:
3-5 work days
Brand:
Winbond Electronics
Product Description
Product Details
GENERAL DESCRIPTION
The W631GG6KB is a 1G bits DDR3 SDRAM, organized as 8,388,608 words x 8 banks x 16 bits. This device achieves high speed transfer rates up to 1866 Mb/sec/pin (DDR3-1866) for various applications. W631GG6KB is sorted into the following speed grades: -11, -12, 12I, 12A, 12K -15, 15I, 15A and 15K. The -11 speed grade is compliant to the DDR3-1866 (13-13-13) specification. The -12, 12I, 12A and 12K speed grades are compliant to the DDR3-1600 (11-11-11) specification (the 12I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C). The -15, 15I, 15A and 15K speed grades are compliant to the DDR3-1333 (9-9-9) specification (the 15I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C).
FEATURES
Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle
Eight internal banks for concurrent operation
8 bit prefetch architecture
CAS Latency: 6, 7, 8, 9, 10, 11 and 13
Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable On The-Fly (OTF)
Programmable read burst ordering: interleaved or nibble sequential
Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received with data
Edge-aligned with read data and center-aligned with write data
DLL aligns DQ and DQS transitions with clock
Differential clock inputs (CK and CK#)
Commands entered on each positive CK edge, data and data mask are referenced to both edges of a differential data strobe pair (double data rate)
Posted CAS with programmable additive latency (AL = 0, CL - 1 and CL - 2) for improved command, address and data bus efficiency
Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
Auto-precharge operation for read and write bursts
Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)
Precharged Power Down and Active Power Down
Specifications
| Attribute | Attribute Value |
|---|---|
| Manufacturer | Winbond Electronics |
| Product Category | Memory ICs |
| Categories | Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) |
| Manufacturer | Hirose Electric Co Ltd |
| Series | IT1 |
| Packaging | Tray |
| Part-Status | Active |
| Connector-Type | Module, Center Strip Contacts |
| Number-of-Positions | 252 Positions |
| Pitch | 0.020" (0.50mm) |
| Number-of-Rows | 2 Rows |
| Mounting-Type | - |
| Features | Double Sided |
| Contact-Finish | Gold |
| Contact-Finish-Thickness | - |
| Mated-Stacking-Heights | - |
| Height-Above-Board | - |
Descriptions
SDRAM - DDR3 Memory IC 1Gb (64M x 16) Parallel 800MHz 20ns 96-WBGA (9x13)
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Sanhuang electronics (Hong Kong) Co., Limited
Location
No. 2520, 25th Floor, Block A, New Asia Guoli Building, Huaqiang North Street, Shenzhen, China
Contact Person
Zhao