99% Alumina Ceramic Components Chip Thin Film Circuit Semiconductor
Alumina ceramic basic chip thin-film circuit semiconductor-integrated circuit led lamp
Alumina ceramic basic chip
product name:Alumina ceramic basic chip
product description:
As a substrate material, alumina ceramic substrate is widely used in RF and microwave electronics industry. Its high dielectric constant can make the circuit miniaturized. Its thermal stability is good, the temperature drift is small, the substrate strength and chemical stability are high, and the performance is better than most other oxide materials. It can be applied to various types of thick film circuits, thin film circuits, hybrid circuits, microwave module modules, etc. Alumina ceramic substrate can be processed based on thin film lithography process, and its accuracy can reach micron level. Many passive devices can be designed based on alumina ceramic substrate. Because its dielectric constant is higher than that of general PCB substrate, the size of the designed device is small, which has a very significant advantage in the development trend of miniaturization of various component modules. Alumina ceramic substrate plays an important role in the development of microwave radio frequency.
Circuit Application of Alumina Ceramic Substrate
1 Thin film microstrip circuit
2 thin film filter
3 thin film load
4 Thin film equalizer
5 thin film power divider
6 Thin film attenuator
7 thin film coupler
8 thin film bridge
9 thin film resistance
10 thin film capacitor
products index:
| Ceramic characteristic table | |||
| name | 99% AL2O3 | 95% AL2O3 | |
| physical propertyessential component | essential component | AL2O3≥99% | AL2O3≥95% |
| Density(g/cm3) | 3.85 | 3.6 | |
| water absorption% | 0 | 0 | |
| sintering temperature | 1690 | 1670 | |
| material characters | Hardness(HV) | 1700 | 1600 |
| break off strength | >6500 | >2900 | |
| compressive strength | 30000 | 25000 | |
| thermal response | maximum service tempera- ture | 1500 | 1400 |
| thermal expansion coefficient | 8 | 7.8 | |
| 10-6/℃ | |||
| 0-1000℃ | |||
| Heat shock resistance T(℃) | 200 | 220 | |
| thermal conductivity W/m.k | 31 | 22 | |
| electrical specification | volume resistivity Ω.cm | >1012 | >1012 |
| Insulation destructive power KT/m | 18 | 16 | |
| dielectric constant 1MHZ(E) | 9.2-10.5 | 9.0-10 | |
Product production process steps:
1 Hot grouting molding equipment 2 Dry powder molding press 3 Automatic dry powder forming equipment
4High temperature kiln workshop firing 5 Product firing 6 processing units
7processing units 8 processing units 9 product presentation
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