Flex Printed Circuit Board (FPC) is made of flexible insulating substrates (mainly polyimide PI or polyethylene terephthalate PET), which can be freely bent, wound, folded, and can withstand hundreds of thousands to millions of bends without damage.

Product specification:

Flexible circuit board addvantages: 

FPC can be bent and folded, providing greater freedom in the design and operation of applications. FPC can also adapt to small spaces or irregularly shaped spaces, which is a function that standard rigid pcbs do not possess.

FPC occupy less space, thereby reducing the weight of the application motherboard. In addition to optimizing space utilization, it can also achieve better thermal management, then reducing the amount of heat to be dissipated.

Compared to rigid PCBs, flexible printed circuits are also more reliable and durable, especially in applications where the circuit can withstand continuous vibration and mechanical stress. The standard interconnection technology based on welding wires and manual wiring connectors has been replaced by flexible printed circuits. The characteristics of flexible printed circuits are extremely light weight, extremely thin thickness, high mechanical resistance, high temperature and atmospheric resistance, and good electromagnetic interference (EMI) resistance.

The use of FPC can reduce the incidence of human errors during the wiring process, thereby improving quality and reducing costs. FPC technology helps significantly reduce the size and weight of applications, which is a key factor in creating reliable, compact, and highly integrated electronic devices.