Customized GSM wireless communication module PCB assembly manufacturer
Product parameters
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SMT (Surface-Mount Technology)
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THD (Thru-Hole Device)
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SMT & THD mixed
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Double sided SMT and THD assembly
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PCB layer: 1-32 layers;
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PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
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Board type: Rigid FR-4, Rigid-Flex boards
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PCB thickness: 0.2mm-7.0mm;
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PCB dimension width: 40-500mm;
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Copper thickness: Min:0.5oz; Max: 4.0oz;
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Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
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Component size: 0.6*0.3mm-33.5*33.5mm;
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Component height: 6mm(max);
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Pin spacing laser recognition over 0.65mm;
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High resolution VCS 0.25mm;
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BGA spherical distance: ≥0.25mm;
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BGA Globe distance: ≥0.25mm;
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BGA ball diameter: ≥0.1mm;
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IC foot distance: ≥0.2mm;
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|
|
SMT (Surface-Mount Technology)
|
|
THD (Thru-Hole Device)
|
|
SMT & THD mixed
|
|
Double sided SMT and THD assembly
|
|
|
PCB layer: 1-32 layers;
|
|
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
|
|
Board type: Rigid FR-4, Rigid-Flex boards
|
|
PCB thickness: 0.2mm-7.0mm;
|
|
PCB dimension width: 40-500mm;
|
|
Copper thickness: Min:0.5oz; Max: 4.0oz;
|
|
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
|
|
Component size: 0.6*0.3mm-33.5*33.5mm;
|
|
Component height: 6mm(max);
|
|
Pin spacing laser recognition over 0.65mm;
|
|
High resolution VCS 0.25mm;
|
|
BGA spherical distance: ≥0.25mm;
|
|
BGA Globe distance: ≥0.25mm;
|
|
BGA ball diameter: ≥0.1mm;
|
|
IC foot distance: ≥0.2mm;
|
|
|
SMT (Surface-Mount Technology)
|
|
THD (Thru-Hole Device)
|
|
SMT & THD mixed
|
|
Double sided SMT and THD assembly
|
|
|
PCB layer: 1-32 layers;
|
|
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
|
|
Board type: Rigid FR-4, Rigid-Flex boards
|
|
PCB thickness: 0.2mm-7.0mm;
|
|
PCB dimension width: 40-500mm;
|
|
Copper thickness: Min:0.5oz; Max: 4.0oz;
|
|
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
|
|
Component size: 0.6*0.3mm-33.5*33.5mm;
|
|
Component height: 6mm(max);
|
|
Pin spacing laser recognition over 0.65mm;
|
|
High resolution VCS 0.25mm;
|
|
BGA spherical distance: ≥0.25mm;
|
|
BGA Globe distance: ≥0.25mm;
|
|
BGA ball diameter: ≥0.1mm;
|
|
IC foot distance: ≥0.2mm;
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Company Introduction
Guangzhou Kaijin Precision Manufacturing Co., Ltd. is a focus on the electronics industry SMT/DIP high-end circuit board processing, the company has 60 employees, the existing high-speed patch production line four, 3 new YAMAMHA patch lines, a total of 6 machines, 1 SONY patch production line a total of 2 sets, offline AOI inspection equipment 4 sets, daily average patch production capacity of 6 million points, plug-in production lines 2, tin production line 2, new lead-free wave soldering, daily average production capacity of 1.2 million points, Lead-free assembly 30-meter production line 2, daily assembly of about 3,000 products, peripheral auxiliary equipment is perfect, can ensure the integrity of product quality, many places to achieve automated processes, for customers
For qualified products!
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