Paremeter
Samples(<3m2)
Small volume and mass production(≥3m2)
Remark
Layer count
60
32
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Board thickness(mm)
0.4-7.0
0.6-5.0
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HDI
4+N+4
3+N+3
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Copper thickness(OZ)
0.5OZ,1OZ,2OZ,3OZ,4OZ-10OZ
0.5OZ,1OZ,2OZ,3OZ,4OZ
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Laser drill size/4mil
4mil
4mil
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hole size(mm)
0,15-6.5
0.2-6.3
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Aspect ratio
25:1
15:1
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Distance of hole to conductor(mil)
5
6
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Trace width/spacing(inner layer)(mil)
2.5/2.5mils
3.0/3.0mils
Decided by copper thickness
Trace width/spacing(outer layer)(mil)
3/3mils
3.0/3,0mils
Decided by copper thickness
BGA size(mil)
6
8
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Solder mask
Green/matt green, yellow ,red, blue ,black ,white ,
Green/matt green, yellow ,red, blue ,black ,white ,
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Solder mask bridge (mil)

3.5

4
Decided by copper thickness and sm color

Surface finishing
Flash gold , ENIG , ENEPIG , gold fingers, Hard gold, immersion silver, immersion tin, HASL , HASL LF, OSP
Flash gold , ENIG , ENEPIG , gold fingers, Hard gold, immersion silver, immersion tin, HASL , HASL LF, OSP

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Material
FR4 material:IT180A, TU768,S1000-2M, 370HR, 185HR ,EM-827
High speed material: M4S, M6 ,IT968, FR408HR, IT170GRA1, N4000-13
High frequency material:Rogers 4350b,4003c, RO3003G2, 3010 ,RT5880

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PCB size(mm)
9*9mm~ 600*900mm
20*20mm~580*690mm
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