Suntek Electronics Co., Ltd.
                                                                                                           
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14 Years
Since 2012
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Communication PCB Assembly 2-40 Layer Rigid & 1-10 Layer Rigid-Flex Boards for 5G Infrastructure

Price Negotiable
Price: Customized products
MOQ: 1pcs
Delivery Time: 5-7days after all components kitted
Brand: Suntek Electronics Co., Ltd
Product Description
Communication PCB Assembly Services
Suntek Group delivers comprehensive EMS solutions including PCB/FPC assembly, cable assembly, mixed technology assembly, and box-build services through facilities in Hunan, China and Kandal, Cambodia.
Technical Specifications
Parameter Specification
PCBA Testing AOI, X-RAY, ICT, Function Test
PCB Assembly Method BGA
Minimum Hole Tolerance ±0.05mm
Layers 2-40 Layers (Rigid), 1-10 Layers (Rigid-Flex)
PCB Thickness 0.2-7.0mm
Surface Finish HASL, ENIG, OSP, Immersion Silver, Immersion Tin
PCB Quality System ROHS Compliant
Minimum Line Width/Spacing 0.1mm
Communication Industry Applications
PCBs serve critical functions across wireless networks, transmission systems, data communication infrastructure, and broadband networks, often incorporating high-value components like backplanes, high-frequency boards, and multi-layer PCBs.
Telecommunication PCB Applications
  • Wireless communication systems and mobile phone towers
  • Telephonic switching and PBX systems
  • Industrial and commercial wireless communication technology
  • Video conferencing and collaboration systems
  • Satellite systems and space communication devices
  • High-speed servers, routers, and data storage devices
  • Digital/analog broadcasting and VoIP systems
  • Signal boost systems and security communication technology
5G Infrastructure Support
Our PCBs are engineered to meet the demanding requirements of next-generation 5G mobile networks, supporting the extensive infrastructure development driving communication board demand.
Material Technology
While specialized substrates handle extreme temperatures, our high-Tg FR-4 laminates provide reliable performance up to 150°C+ with cost efficiency and manufacturing familiarity.
Product Gallery
Communication PCB assembly with multiple layers and components High-density rigid PCB for telecommunications equipment Advanced rigid-flex PCB assembly for communication systems Multi-layer communication PCB with surface mount technology Telecommunication PCB with BGA components and testing points High-frequency communication circuit board assembly Industrial communication PCB with multiple connectivity options Advanced telecommunication system PCB with complex routing Communication infrastructure PCB with robust construction Multi-layer telecommunication board with precision components

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Suntek Electronics Co., Ltd.
Location Building 3, No.68 Luositang Road,Changsha E&D Zone,Changsha,Hunan,China,410100
Contact Person Suntek Group Marketing Dept

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