Custom Communication PCB Assembly for Backplane High-Frequency Multi-Layer Boards 2-10 Layers 0.2-7.0mm Thickness
Price:
Customized products
MOQ:
1pcs
Delivery Time:
5-7days after all components kitted
Brand:
Suntek Electronics Co., Ltd
Product Description
Custom Communication PCB Assembly Services
About Suntek Group
Located in Development Zone, Changsha City, Suntek is a leading EMS supplier with over 10 years of experience in PCB assembly and cable assembly. Certified with ISO 9001:2015, ISO 13485, IATF 16949, and UL, we deliver qualified products at competitive prices to global clients.
Technical Specifications
| Parameter | Specification |
|---|---|
| PCBA Testing | AOI, X-RAY, ICT, Function Test |
| PCB Assembly Method | BGA |
| Minimum Hole Tolerance | ±0.05mm |
| Layers | 2-10 |
| PCB Thickness | 0.2-7.0mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| PCB Process | Immersion Gold |
| PCB Quality System | ROHS |
| Min. Line Width/Spacing | 0.1mm |
Communication PCB Applications
With the rapid development of information and communication technologies, PCBs serve as the foundation for component assembly and integrated circuits, enabling high-speed signal transmission in devices like smartphones, wireless routers, base stations, and communication equipment.
Communication device PCBs facilitate interconnections between active and passive components using conductive copper traces, providing mechanical support and electrical connections while ensuring accurate signal transmission without unacceptable loss or interference.
Industry Applications
- Wireless communication systems
- Mobile phone tower systems
- Telephonic switching systems
- PBX systems
- Industrial wireless communication technology
- High speed servers and routers
- Electronic data storage devices
- Satellite systems and communication devices
- Video collaboration systems
- Digital and analog broadcasting systems
- Voice over Internet Protocol (VoIP)
- Security technology and information communication systems
5G Communication Infrastructure
As 5G becomes the next generation mobile communication network, extensive infrastructure construction will significantly boost demand for high-frequency communication boards, backplanes, and multi-layer PCBs.
Material Technology
While specialized substrates like polyimides and ceramics handle extreme temperature swings, FR-4 laminates have evolved with "high Tg" versions usable to 150°C+, offering lower cost and better fabricator familiarity for many industrial applications.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Suntek Electronics Co., Ltd.
Location
Building 3, No.68 Luositang Road,Changsha E&D Zone,Changsha,Hunan,China,410100
Contact Person
Suntek Group Marketing Dept