Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

Price Negotiable

Price: ￥0.02-0.11/pcs

MOQ: 100pcs

Delivery Time: 11-13work days

Brand: Bright Pack

Product Description

Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

Product Attributes

Attribute	Description
Material Structure	4-layer composite: Static-dissipative polyethylene (outer layer) / Aluminum shielding / Polyester (middle layer) / Static-dissipative coating (inner layer). Optimized for surface resistance control.
Surface Resistance	≤10¹² Ω/sq (anti-static range), compliant with ANSI/ESD S541 and IEC 61340-5-1 standards.
Certifications	ISO 9001, ISO 14001, and RoHS/REACH compliance. Suitable for electronics in EPA (ESD Protected Areas).
Barrier Properties	Moisture-resistant (WVTR ≤5 g/m²24h at 38°C/90% RH); moderate oxygen barrier (OTR ≤50 cm³/m²day).
Design Features	Octagonal bottom for stability; heat-sealable or zip-lock closure; customizable print area for branding.
Applications	PCB, RAM, motherboards, IC chips, and other ESD-sensitive components.
Sustainability	Recyclable polyethylene layers; optional biodegradable additives.

Technical Specifications

Parameter	Specification
Thickness Range	0.08-0.15 mm (customizable for lightweight to heavy-duty electronics).
Dimensions	Width: 100-400 mm; Height: 150-600 mm; Bottom gusset: 50-150 mm.
Tear Resistance	≥35 N (machine direction) / ≥30 N (transverse direction).
Seal Strength	5-8 N/15mm (heat-sealable at 120-140°C).
Static Dissipation	Surface resistance: 10⁶-10¹² Ω/sq; ESD shielding energy ≤30 nJ.
Printing Options	4-color flexographic printing (±0.2 mm accuracy); supports QR codes and GS1 barcodes.
Temperature Range	-40°C to 85°C (suitable for cold chain and industrial environments).
MOQ & Lead Time	MOQ 50,000 units; production lead time: 15-25 days.