High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
Price:
Negotiable
MOQ:
≥1 pc
Delivery Time:
25~50 days
Brand:
Suneast
Product Description
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
Product Overview
The CBD2200 EVO IC Bonder is a high-speed, precision modular platform designed for efficient semiconductor packaging with minimal floor space requirements.
Key Specifications
| Attribute | Value |
|---|---|
| Model | CBD2200 EVO |
| Machine Dimensions | 1400(L) × 1250(W) × 1700(H) mm |
| Weight | Approx. 1500Kg |
| Placement Accuracy | ≤±10um@3σ |
| Placement Angle Accuracy | ±0.15°@3σ |
| Substrate Pallet Size | L200 × W90~150mm |
| Movement Mode | Linear motor + grating scale |
| Glue Feeding Mode | Dispensing + painting glue |
| Customization | Available |
Product Features
- High-speed operation with ±10um@3σ placement accuracy
- Compact modular design minimizes floor space requirements
- Multi-chip processing capability supports 16 different chip types
- Flexible operation with multiple carrier support
- Deep cavity operation capability (up to 11mm)
- High production efficiency with low operational costs
Technical Advantages
High precision linear motor system with ±10μm accuracy
Supports 16 Waffle packs (2"x2" or 4"x4" sizes)
3μm accuracy height measurement with multiple probe options
Quick-change nozzle system with 7 station capacity
High-resolution 2448x2048 visual recognition system
11mm maximum depth deep cavity operation
Dispensing Function Features
- Compatible with various epoxy adhesive types
- Flexible graphic dispensing capabilities
- Includes standard graphics library
- Supports custom graphic creation
Detailed Technical Parameters
| Parameter | Specification |
|---|---|
| Placement Accuracy | ≤±10um@3σ |
| Placement Angle Accuracy | ±0.15°@3σ |
| Force Control Range | 20~1000g (configurable up to 7500g) |
| Force Control Accuracy | 20g-150g:±2g@3σ; 150g-1000g:±5%@3σ |
| IC Dimensions | L0.25×W0.25 to L10×W10 mm |
| Loading/Unloading | Manual or automatic options |
| Bottom Photo-taking | Equipped with camera |
Installation Requirements
1. Leakage protection switch: ≥100ma
2. Compressed air: 0.4-0.6Mpa (Ø10mm inlet pipe)
3. Vacuum requirement: <-88kPa (Ø10mm inlet pipe, 2 tracheal joints)
4. Power: AC220V, 50/60Hz (≥2.5mm² three-core power copper wire, 50A leakage protection switch)
5. Floor loading capacity: ≥800kg/m²
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Location
Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
Contact Person
Yang