GRACYFIBER's Lidless FA is a high-precision optical interface component designed to overcome the challenges of extreme space limitations and high-density optical packaging. Abandoning the traditional top glass cover, this array's unique open structure provides production lines with direct access to the fiber optics, enabling more flexible active alignment and visual inspection within complex, high-density optical packaging. Built on a precision glass or silicon substrate with micron-level alignment control, our coverless fiber array is only 1.5 mm high, achieving extremely low insertion loss while seamlessly integrating into the demanding 3D spatial architecture of near-package optics (NPO) and ultra-thin optical modules.

(Designed to solve your space-constrained packaging and active alignment pain points)

Pain point/value solved: The overall height is strictly controlled to 1.5 mm. This ultra-thin design directly eliminates the physical barrier of Z-axis height limitations in silicon photonics packaging and co-packaged optics (CPO) systems, enabling direct fiber coupling above the surface of photonic integrated circuits (PICs).

Pain point/value solved: Pitch tolerances as low as ±0.3 μm to ±0.5 μm in configurations from 1 to 32 channels. This micron-level precision significantly reduces the computational complexity and time consumption of automated active alignment in multi-channel arrays, comprehensively improving the mass production yield of high-density optical modules.

Solved Pain Points/Value: Combining the excellent return loss performance of UPC ≥ 45 dB and APC ≥ 55 dB, back reflections at the optical interface are effectively eliminated. This preserves valuable optical power budget for high-speed data transmission networks and fundamentally ensures signal purity and integrity.

Solved Pain Points/Value: Completely eliminates top obstruction, allowing machine vision alignment systems to directly and clearly observe the fiber array arrangement. This not only simplifies testing processes in R&D laboratories but also significantly accelerates alignment efficiency for automated equipment on production lines.

Pain points addressed/value: Supports full-band operation from 460 nm to 1950 nm, and is perfectly compatible with OM1-OM5, G.657 series single-mode fiber, and custom fiber. A single component platform can meet diverse system needs from sensing and measurement to data communication and coherent transmission.

Our Lidless FA is a core component of next-generation compact and ultra-high-density optoelectronic systems:

• Silicon Photonics Packaging & Testing: Ideal optical interface for chip-level optical test benches and wafer-level probing.
• High-Density Optical Modules: Meets the internal compact wiring requirements of 400G/800G ultra-thin optical modules (such as QSFP-DD, OSFP).
• Active Optical Alignment Processes: Accelerates machine vision positioning in automated coupling equipment.
• Optical Sensing & Measurement Systems: Provides stable optical paths for high-precision LiDAR and interferometers.
• Telecom & Data Communication Devices: High-efficiency optical interconnect nodes for core network equipment.
• Custom Integrated Optical Subsystems: Tailor-made for volume-sensitive applications such as aerospace.