PIC Coupling Lensed Fiber Array Unit 1CH 2CH 4CH 8CH 12CH 16CH 24CH 32CH 48CH
Lens Fiber Arrays (1CH, 2CH, 4CH, 8CH, 12CH, 16CH, 24CH, 32CH, 48CH) For PIC Coupling, Silicon Photonics, And Optical Packaging
This Lens Fiber Array is a microlens fiber array assembly designed specifically for PIC chip coupling and high-density photonic packaging applications. It supports various channel configurations ranging from 1 to 48 cores and is suitable for the 980nm, 1060nm, and 1260–1650nm wavelength bands. Constructed using Pyrex, Tempax, or Quartz materials, the product features a standard lid-equipped structure and offers a variety of core pitch options—including 250μm, 127/350μm, 127/250μm, and 127μm—to accommodate diverse chip port layouts and packaging space constraints.The pigtail supports 250μm or 900μm loose-tube cabling, as well as ribbon structures; connector options include FC, LC, SC, E2000, MT, MPO, and MMC, with custom connector configurations also available.
| Parameter | Unit | 1 | 2 | 4 | 8 | 12 | 16 | 24 | 32 | 48 | |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Wavelength | nm | 980,1060,1260~1650 | |||||||||
| Materials | - | Pyrex, Tempax, Quartz | |||||||||
| Lid Option | Lid | ||||||||||
| CorePitch | - | - | 250 | 127/350 | 127/250 | 127/250 | 127 | 127 | 127 | 127 | |
| Core Pitch Tolerance | μm | +/-0.3 | +/-0.5 | +/-0.7 | |||||||
| Polish Angle | Degree | 8°,90° or customized (12°, 21°,...) (±0.5°) | |||||||||
| Beam Waist (Spot Size) | μm | 2–5 (Customizable to match PIC MFD) | |||||||||
| Working Distance | μm | 10–30 | |||||||||
| Mode Matching | μm | Optimized for PIC | |||||||||
| Insertion Loss | dB | ≤1.2(Typical 1.0) | |||||||||
| Return Loss | dB | UPC≥40, APC≥50 | |||||||||
| FA Dimension | W | mm | 2.5 | 2.5 | 2.5 | 2.5 | 3.5 | 3.5 | 5.7 | 5.7 | 9 |
| H | mm | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | |
| L | mm | 10 | 10 | 10 | 10 | 10 | 12 | 12 | 12 | 12 | |
| - | - | Standard or Customized | |||||||||
| Fiber Type | - | OM1/OM2/OM3/OM4/OM5/G67A1/ A2/ B3 or Customized | |||||||||
| Fiber Coating | um | 250 µm / 900 µm loose tube / ribbon (optional) | |||||||||
| Fiber Type Length | cm | 100+/-10 or customized | |||||||||
| Connector | - | .FC/LC/SC/E2000/MT/MPO/MMC | |||||||||
| Operation Temperature | °C | -5~65 | |||||||||
| Storage Temperature | °C | -40~85 | |||||||||
- Supports various array configurations ranging from 1 to 48 channels
- Compatible with 980nm, 1060nm, and 1260–1650nm wavelength bands
- Spot size of 2–5μm; customizable to match the Mode Field Diameter (MFD) of the PIC
- Working distance of 10–30μm, ideal for high-precision chip coupling
- Mode field matching optimized for PIC applications
- Insertion loss ≤ 1.2dB (typical value: 1.0dB)
- Supports customization of various core pitches, materials, and connectors
- Compatible with OM1/OM2/OM3/OM4/OM5 and G657A1/A2/B3 fiber types
- PIC (Photonic Integrated Circuit) coupling
- Silicon photonics device packaging
- Optical engine and optical module packaging
- High-density fiber array interconnection
- Chip-level optical coupling testing
- OEM optical communication components
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