This 2D FA is a two-dimensional fiber array assembly designed for high-density optical interconnects and advanced photonic packaging applications. It supports various high-channel configurations—including 16, 32, 64, 128, 256, 512, and 1024 channels—and operates within the 1260–1650 nm wavelength range. Constructed using glass or ceramic materials, the product features a 2D matrix array structure with a core pitch of 127 μm. The core pitch tolerance is strictly controlled to within ±1 μm, making it ideally suited for applications demanding high array precision, channel uniformity, and high-density spatial arrangement. The device exhibits an insertion loss of ≤0.8 dB (with a typical value of 0.5 dB) and a return loss of ≥40 dB for UPC and ≥50 dB for APC, thereby enhancing system coupling efficiency and transmission stability.

• Supports high-density 2D array configurations ranging from 16 to 1024 channels
• Compatible with the 1260–1650 nm operating wavelength range
• Utilizes glass or ceramic materials
• Features a 2D matrix array structure with a 127 μm core pitch
• Core pitch tolerance of ±1 μm
• Insertion loss ≤0.8 dB (typical value: 0.5 dB)
• Return loss: UPC ≥40 dB, APC ≥50 dB
• Supports customization of various fiber types, pigtail structures, and connectors

• High-density optical interconnects
• Silicon photonics chip packaging
• 2D fiber array coupling
• High-channel-count optical modules
• Board-level optical communication systems
• Optical testing platforms
• OEM optical communication components