Ring PCB Technology Co.,Limited
                                                                                                           
Verified Supplier
18 Years
Since 2008
Menu

12 Layer Rigid Flex PCB Board with 3/3mil Trace Spacing and ±7% Impedance Control for Electronics

Price Negotiable
Price: negotiable
MOQ: 1unit
Delivery Time: 7-14 working days
Brand: Ring or support OEM
Product Description
Multilayer Rigid Flex PCB Board - 12 Layer Circuit Board
Ring PCB provides professional PCB & PCBA turnkey solutions with 17 years of manufacturing expertise. Our 12-layer rigid-flex PCBs combine rigid and flexible layers in a single structure, offering both stability for component mounting and flexibility for complex space requirements.
12 Layer Rigid Flex PCB Board showing multilayer construction Close-up view of rigid-flex PCB circuit patterns
Key Product Features
Superior Flexibility & Space Efficiency
Combines rigid and flexible layers allowing bending, folding, or twisting in tight spaces while maintaining stable electrical performance.
Durability & Reliability
Crafted with high-quality materials to endure harsh environments including vibration, temperature fluctuations, and mechanical stress.
Excellent Electrical Performance
Precise circuit routing and advanced manufacturing techniques ensure superior signal integrity and low electrical interference.
Customizable Design
Tailored solutions with adjustable layer structures, material selection, and form factors to match specific product requirements.
Advanced Manufacturing Processes
Our Shenzhen facility utilizes specialized equipment and manufacturing processes for precision rigid-flex PCB production:
  • Lamination and Bonding: Advanced techniques for seamless layer integration
  • Laser Drilling and Routing: High accuracy for compact designs with small vias
  • Controlled Impedance: ±7% impedance control for high-frequency signal integrity
  • Surface Finishing: ENIG, HASL, and Immersion Silver options for enhanced durability
Rigid-flex PCB manufacturing process showing lamination PCB surface finishing and quality inspection
Industry Applications
  • Aerospace & Defense: Withstands extreme conditions in aircraft and defense systems
  • Automotive Electronics: ADAS systems and infotainment modules
  • Consumer Electronics: Smartphones, wearables, and portable devices
  • Medical Devices: Portable monitors, diagnostic tools, and implants
Production Timeline
Sample production: 7 working days | Mass production and delivery: 15 working days
Technical Specifications
Parameter Specification
Layers 12 Layer (2-48 layers available)
Trace/Spacing 3/3mil minimum
Impedance Control ±7% tolerance
Quality Standards IPC-6012 Class 3, ISO9001, IATF16949, RoHS
Defect Rate <0.2% (industry average <1%)
All products are custom manufactured. Please contact our customer service team to confirm product details before ordering. Email: info@ringpcb.com
Similar Products

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

Request A Quote

Please check your email address.
Your message must be at least 20 characters.