Polyimide FR4 Rigid Flex PCB 2-48 Layers with 3/3mil Trace/Spacing for Smart Locks and Security Cameras
Price:
negotiable
MOQ:
1unit
Delivery Time:
7-14 working days
Brand:
Ring or support OEM
Product Description
Polyimide FR4 Rigid Flex PCB Manufacturing
Professional rigid-flex PCB solutions combining rigid FR4 sections with flexible polyimide layers for smart locks, security cameras, and advanced electronic applications.
Product Overview
Rigid-flex PCBs integrate rigid and flexible circuit layers within a single structure, providing both mechanical stability and bending capability. This hybrid design enables optimal space utilization while maintaining reliable electrical performance in compact device architectures.
Key Features & Benefits
Space Optimization
Combines rigid mounting areas with flexible interconnects to maximize space efficiency in compact electronic devices.
Enhanced Durability
Withstands vibration, thermal cycling, and mechanical stress with reduced solder joint failures for long-term reliability.
Electrical Performance
Provides superior signal integrity with low interference, supporting high-speed data transmission requirements.
Custom Design Flexibility
Tailored solutions with adjustable layer structures, material selection, and form factors to match specific application needs.
Advanced Manufacturing Capabilities
Our Shenzhen facility employs specialized equipment and processes for precision rigid-flex PCB production:
- Precision lamination and bonding of rigid-flex layers
- Laser drilling for accurate via formation
- Controlled impedance for high-frequency applications
- Multiple surface finishes: ENIG, HASL, Immersion Silver
Technical Specifications
| Parameter | Specification |
|---|---|
| Layer Count | 2-48 layers |
| Trace/Spacing | 3/3 mil minimum |
| Impedance Control | ±7% tolerance |
| Material Options | Polyimide, FR4, high-frequency laminates |
| Surface Finishes | ENIG, HASL, Immersion Silver, OSP |
Industry Applications
- Aerospace & Defense: Extreme environment electronics
- Automotive: ADAS systems, infotainment modules
- Consumer Electronics: Smartphones, wearables, portable devices
- Medical Devices: Diagnostic equipment, portable monitors, implants
- Industrial Control: Automation systems, sensor networks
Manufacturing Advantages
Advanced Engineering Capabilities
- High-density stack-up with blind/buried vias
- 3/3mil trace/spacing capability
- ±7% impedance control precision
- IPC-6012 Class 3 standards compliance
Integrated PCBA Services
- Complete turnkey solutions: PCB + components + assembly
- DFM/DFA optimization to reduce design risks
- Comprehensive testing: X-ray, AOI, functional validation
Quality Assurance & Certifications
- Self-owned factory with full supply chain control
- Defect rate
- ISO9001, IATF16949, RoHS compliance
- 17 years of manufacturing expertise
Production Timeline
Sample production: 7 working days | Mass production and delivery: 15 working days
Additional Product Samples
Note: All products require customization. Please contact our customer service team to confirm product details before ordering. All images are actual product photos.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Ring PCB Technology Co.,Limited
Location
Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person
Michelle Law