Fast Turn HDI Printed Circuit Board with 3/3mil Trace/Spacing and 2-48 Layer Capability for PCB Assembly
Price:
negotiable
MOQ:
1unit
Delivery Time:
7-14 working days
Brand:
Ring or support OEM
Product Description
HDI PCB Technology Overview
HDI PCBs (High-Density Interconnect Printed Circuit Boards) feature advanced micro-via technology, blind/buried vias, and laser-drilled interconnections that enable higher wiring density per unit area compared to conventional PCBs. This technology supports complex designs with more components in smaller spaces, making HDI PCBs ideal for modern electronics requiring miniaturization and enhanced performance.
Key Product Characteristics
- Compact Design: Micro-vias and blind/buried vias reduce board space significantly, potentially converting 8-layer through-hole designs to 4-layer HDI with equivalent functionality
- Excellent Signal Integrity: Small vias reduce stray capacitance and inductance, while via-in-pad technology shortens signal paths for faster transmission
- High Reliability: Enhanced durability and performance in harsh conditions and extreme environments
- Cost Effective: Reduced manufacturing costs for boards exceeding 8 layers while maintaining full functionality
- High Wiring Density: Finer lines (3/3mil trace/spacing), smaller holes, and higher density than conventional PCBs
Custom Design Capabilities
We provide fully customizable PCB solutions with flexible layer structures, material selection, and form factors to match your specific product requirements. Sample production typically completes within 7 working days, with mass production and delivery within 15 working days.
HDI Manufacturing Solutions
Precision Micro-Via Drilling
Advanced laser drilling technology creates micro-vias under 150 microns diameter with high precision, minimizing misalignments and ensuring reliable electrical connections.
Layer Stacking & Alignment
Automated alignment systems and optical verification ensure perfect layer positioning for multi-layer HDI boards.
Signal Integrity Management
Impedance control and isolation techniques reduce crosstalk and EMI for high-speed signal processing.
Copper Plating Precision
Uniform copper deposition in micro-vias ensures strong, conductive connections with consistent plating thickness.
Thermal Management & Quality Control
We utilize materials with high thermal conductivity, thermal vias, and heat sinks to manage heat flow. Comprehensive quality control includes Automatic Optical Inspection (AOI), X-ray inspection, and Electrical Testing to ensure defect-free performance.
Industry Applications
- Telecommunications: Smartphones, network servers, and communication infrastructure
- Automotive: Electric and autonomous vehicle control systems
- Healthcare: Wearable health monitors, imaging equipment, and diagnostics
- Consumer Electronics: High-performance laptops, tablets, and smartwatches
- Aerospace & Military: High-reliability systems requiring compact, durable electronics
Company Capabilities & Certifications
17 Years of Manufacturing Excellence
Self-owned factory with end-to-end technical support and full supply chain control.
Advanced Engineering Capabilities
2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, adhering to IPC-6012 Class 3 standards.
Integrated PCBA Services
Complete turnkey solutions including PCB fabrication, component sourcing, SMT assembly, and functional testing.
Quality Assurance
ISO9001, IATF16949, and RoHS compliance with defect rate below 0.2%.
For customized PCB and PCBA solutions, please contact our professional team at info@ringpcb.com for one-on-one service and technical support.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Ring PCB Technology Co.,Limited
Location
Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person
Michelle Law