Ring PCB Technology Co.,Limited
                                                                                                           
Verified Supplier
18 Years
Since 2008
Menu

Custom High-Speed PCB Prototype & Assembly Service - Up to 48 Layers, 3/3mil Trace/Spacing

Price Negotiable
Price: negotiable
MOQ: 1unit
Delivery Time: 7-14 working days
Brand: Ring or support OEM
Product Description
Ring PCB provides professional PCB and PCBA turnkey solutions with 17 years of manufacturing expertise. We specialize in high-speed PCB design and assembly for demanding applications.
High-speed PCB prototype board showing intricate circuit patterns
High-Speed PCB Overview
High-speed PCBs are designed for signal transmission above 1GHz or with rise/fall times under 1 nanosecond. These boards ensure reliable performance in high-frequency electronic systems.
Close-up view of high-speed PCB traces and components
Key Characteristics
  • Low Signal Delay: Optimized layout and materials minimize signal travel time
  • Controlled Impedance: Precise impedance values prevent signal reflection and distortion
  • Reduced Crosstalk: Advanced design techniques minimize interference between adjacent traces
Design Considerations
  • Layer stack-up design for optimal electrical characteristics
  • Strategic trace routing to minimize length and avoid discontinuities
  • Optimized component placement for reduced signal path lengths
Custom Design Capabilities
We customize all PCB types including layer structures, material selection, and form factors. Sample production within 7 working days, mass production and delivery within 15 working days.
Custom PCB board with multiple layers and complex routing
Manufacturing Parameters
Parameter Specification
Number of Layers Up to 20 layers (customizable)
Material Type FR-4, Rogers RT/duroid series
Minimum Hole Size 0.2mm - 0.4mm
Line Width/Spacing 0.1mm - 0.3mm
Dielectric Constant 3.0 - 4.5
Dissipation Factor 0.01 - 0.05
Copper Thickness 1oz, 2oz
Board Thickness 1.0mm - 2.0mm
Surface Finish HASL, ENIG
Manufacturing Expertise
Material Selection
We use high-frequency laminates like Rogers and Isola with low dielectric constants and loss tangents to minimize signal degradation.
Impedance Control
Advanced simulation tools ensure precise trace widths and spacing for consistent impedance control and signal integrity.
Signal Integrity
Differential pair routing and advanced layout strategies minimize crosstalk and noise in high-speed circuits.
Thermal Management
Thermal vias and copper pours integrated during design ensure optimal heat dissipation for high-speed circuits.
Precision Manufacturing
State-of-the-art equipment achieves fine trace widths (3/3mil) and tightly packed components with IPC-6012 Class 3 standards.
Quality Assurance
Rigorous testing protocols including AOI and ICT ensure early issue detection and minimize failure risks.
PCB testing equipment performing automated optical inspection
Applications
High-speed PCBs are essential in telecommunications, computer systems, aerospace, defense, and other high-tech fields requiring reliable signal transmission.
Various electronic devices using high-speed PCB technology
Advanced Engineering Capabilities
  • High-density stack-up: 2-48 layer boards with blind/buried vias
  • 3/3mil trace/spacing with ±7% impedance control
  • Smart manufacturing with LDI laser exposure and vacuum lamination
  • Ideal for 5G, industrial control, medical devices, and automotive electronics
PCB manufacturing facility with advanced equipment
Integrated PCBA Services
  • Full turnkey solutions: PCB fabrication + component sourcing + SMT assembly
  • DFM/DFA optimization to reduce design risks and BOM costs
  • Comprehensive quality control with X-ray inspection, AOI testing, and functional validation
SMT assembly line with automated component placement
Self-Owned Factory Advantages
  • Vertical integration with full supply chain control
  • Triple quality assurance: AOI + impedance testing + thermal cycling
  • Defect rate
  • Global certifications: ISO9001, IATF16949, RoHS compliance
PCB assembly facility with modern manufacturing equipment
Our Shenzhen factory features 8-stage lead-free reflow soldering and wave soldering capabilities, ensuring high-quality assembly while meeting environmental standards.
PCB assembly process with automated machinery Quality control inspection of finished PCB boards Completed PCB assembly ready for testing PCB manufacturing quality control station
Custom Service Information
All products are custom services. Please contact our customer service before ordering to confirm details. Ring PCB Technology Co., Limited has 17 years of professional PCB manufacturing experience in China. Contact us at info@ringpcb.com for professional solutions and one-on-one service.
Similar Products

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

Request A Quote

Please check your email address.
Your message must be at least 20 characters.