Ring PCB Technology Co.,Limited
                                                                                                           
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18 Years
Since 2008
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Fast Turn Communication PCBA for Base Stations - 2-48 Layer Boards with 0.1-0.3mm Line Spacing and -40°C to 85°C Operating Range

Price Negotiable
Price: negotiable
MOQ: 1unit
Delivery Time: 10-15 working days
Brand: Ring PCBA ,support OEM
Product Description
Communication PCBA Overview

Communication PCBA (Printed Circuit Board Assembly) refers to printed circuit boards populated with electronic components specifically designed for communication applications. These assemblies serve as core components in routers, wireless access points, mobile phones, and base stations, integrating microcontrollers, radio-frequency chips, and connectors through conductive traces to enable signal processing, transmission, and reception.

Communication PCBA board with high-density component layout
Key Characteristics
  • High-Frequency Performance: Engineered to handle high-frequency signals effectively with minimal signal loss and interference
  • Miniaturization: High-density component layout with advanced manufacturing techniques for compact designs
  • Reliability: High-quality materials and strict manufacturing standards for continuous stable operation
  • Integration: Combines multiple functions including data processing, modulation, and communication protocols
  • Customizability: Adjustable communication frequency band, data transfer rate, and power consumption
Technical Specifications
ParameterSpecification
Board Thickness0.8 - 2.4mm
Line Width/Spacing0.1 - 0.3mm / 0.1 - 0.3mm
Surface FinishENIG, HASL, and other options
Operating Temperature-40°C to 85°C
Signal FrequencykHz to GHz range depending on application
Power ConsumptionFew mW to several W based on components
Component DensityHigh density with dozens to hundreds of components per square inch
Assembly Accuracy±0.05 - 0.1mm tolerance for component placement
Insulation Resistance≥1000MΩ
Manufacturing Solutions
Signal Integrity

Controlled impedance PCB designs with low-loss materials (Rogers, Isola, Nelco) and TDR testing for optimal performance.

Thermal Management

Copper heat sinks, thermal vias, and aluminum-backed PCBs with 8-stage lead-free reflow soldering.

HDI Technology

Microvias, blind/buried vias, and fine-pitch technology for multi-layer PCBs up to 48 layers.

Environmental Protection

Conformal coatings and encapsulation services with environmental simulation and thermal shock testing.

Advanced PCB manufacturing equipment and testing facilities
Quality Assurance

Our manufacturing processes comply with global standards including ISO9001, IATF16949, and RoHS. We maintain defect rates below 0.2% through comprehensive testing including AOI, X-ray inspection, and 100% functional validation.

Quality control and inspection processes for PCBA manufacturing
Custom Service Notice

All products are custom services. Please contact our customer service before ordering to confirm product details. All photos are real images with potential minor color variations due to lighting and display differences.

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

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