Ring PCB Technology Co.,Limited
                                                                                                           
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18 Years
Since 2008
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Communication PCB SMT Assembly Service with 2-48 Layer Boards and ±7% Impedance Control for High-Frequency Applications

Price Negotiable
Price: negotiable
MOQ: 1unit
Delivery Time: 10-15 working days
Brand: Ring PCBA ,support OEM
Product Description
Communication PCB Assembly Services
Custom optical fiber communication equipment PCB and SMT PCB assembly solutions for high-frequency applications.
Communication PCB assembly manufacturing process
Communication PCBA Overview
Communication PCBA (Printed Circuit Board Assembly) refers to printed circuit boards populated with electronic components specifically designed for communication applications. These serve as core components in routers, wireless access points, mobile phones, and base stations, integrating microcontrollers, radio-frequency chips, and connectors through conductive traces to enable signal processing, transmission, and reception functions.
High-frequency communication PCB assembly
Key Characteristics
  • High-Frequency Performance: Engineered to handle high-frequency signals effectively with minimal signal loss and interference
  • Miniaturization: High-density component layout with advanced manufacturing techniques
  • Reliability: High-quality materials and strict manufacturing standards for continuous operation
  • Integration: Combines data processing, modulation, demodulation, and communication protocols
  • Customizability: Adjustable communication frequency bands, data transfer rates, and power consumption
Applications
Communication PCBAs are used in mobile network base stations, routers and modems for internet connectivity, satellite communication systems, optical networking equipment, and IoT smart technology devices.
Communication PCB assembly applications
Technical Specifications
Parameter Specification
Board Thickness 0.8 - 2.4mm
Line Width/Spacing 0.1 - 0.3mm / 0.1 - 0.3mm
Surface Finish ENIG, HASL, and other options
Operating Temperature -40°C to 85°C
Signal Frequency kHz to GHz range depending on application
Assembly Accuracy ±0.05 - 0.1mm tolerance
Insulation Resistance ≥1000MΩ
Manufacturing Solutions
Signal Integrity Management
Controlled impedance PCB designs with low-loss materials (Rogers, Isola, Nelco) and TDR testing to ensure signal quality.
Thermal Management
Copper heat sinks, thermal vias, and aluminum-backed PCBs with 8-stage lead-free reflow soldering.
HDI & Miniaturization
Microvias, blind/buried vias, and fine-pitch technology for multi-layer PCBs up to 48 layers.
Environmental Protection
Conformal coatings and encapsulation services with environmental simulation and thermal shock testing.
PCB assembly quality control process
Why Choose Ring PCB
Advanced Engineering Capabilities
2-48 layer boards with 3/3mil trace/spacing, ±7% impedance control, and IPC-6012 Class 3 standards compliance.
Integrated PCBA Services
Full turnkey solutions including PCB fabrication, component sourcing, SMT assembly, and functional testing with X-ray and AOI inspection.
Quality Assurance
Self-owned factory with vertical integration, triple quality assurance, and defect rate below 0.2%.
Ring PCB manufacturing facility
Please Note: All products are custom services. Contact our customer service before ordering to confirm product details. Ring PCB Technology has 17 years of experience in professional PCB manufacturing and PCBA customization services.
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Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

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