Ring PCB Technology Co.,Limited
                                                                                                           
Verified Supplier
18 Years
Since 2008
Menu

Custom Multilayer PCB 2-40 Layers with 0.1mm Laser Drilling and Fast 3-Day Prototyping Service

Price Negotiable
Price: negotiable
MOQ: 1
Delivery Time: 7-14 working days
Brand: Ring PCB or support OEM
Product Description
Custom Multilayer PCB Manufacturing & Assembly Services
Ring PCB specializes in custom multilayer printed circuit board solutions and advanced PCB manufacturing with 17 years of industry experience. We provide professional PCB fabrication, assembly, and turnkey PCBA services trusted by clients worldwide.
Operating two modern facilities in Shenzhen and Zhuhai covering 5,000㎡ with over 500 skilled employees, all products meet strict international certifications including ISO9001, ISO14001, ISO13485, and IATF16949. From rapid prototyping in 3 days to mass production within 7 days, we ensure high efficiency, precision, and consistent quality.
Custom multilayer PCB manufacturing facility and production process
Industry Applications
Our multilayer PCBs serve diverse industries with tailored solutions:
  • Automotive electronics - ADAS, EV power systems, lighting, and infotainment
  • Medical devices - Imaging systems, monitoring equipment, wearable health electronics
  • Telecommunication & Networking - 5G base stations, routers, high-frequency boards
  • Consumer Electronics - Smartphones, IoT devices, smart home products
  • Industrial Control - Automation, robotics, instrumentation, and power supplies
  • Aerospace & Defense - High-reliability PCBs for radar, navigation, and communication systems
Advanced multilayer PCB technical capabilities and manufacturing processes
Technical Capabilities
Ring PCB has overcome critical technical challenges in multilayer PCB manufacturing:
  • High-density interconnect (HDI) fabrication with laser drilling down to 0.1mm
  • Impedance control for high-frequency and high-speed signal integrity
  • Thermal management for high-power and LED metal-core PCBs
  • Rigid-flex integration for lightweight, space-saving designs
  • Fine-pitch BGA and microvia plating to support advanced IC packaging
  • Low-loss materials for RF and microwave PCB applications
Technical Specifications
Specification Capability
PCB Layers 2-40 layers
Maximum Board Size 600mm × 1200mm
Minimum Trace/Space 3mil/3mil (0.075mm)
Minimum Hole Size 0.1mm (Laser drilling)
Surface Finishes HASL, ENIG, Immersion Tin, OSP, Hard Gold, etc.
Materials FR4, High-Tg FR4, Rogers, Polyimide, Metal-core, Halogen-free
Thickness Tolerance ±10%
Copper Thickness 0.5oz - 6oz
Solder Mask Colors Green, Black, Blue, White, Red, Yellow
Assembly Service SMT, DIP, Mixed, BGA, COB, Fine-pitch (down to 0.25mm)
Testing 100% E-test, AOI, X-ray inspection, Functional testing
Your Trusted PCB Manufacturing Partner
With over 17 years of expertise, Ring PCB ensures every custom multilayer PCB is built to the highest standards. From OEM & EMS services to full-turnkey PCBA solutions, we provide a complete supply chain that helps reduce costs, accelerate time-to-market, and guarantee reliability.
Contact us today at info@ringpcb.com or visit www.turnkeypcb-assembly.com
Similar Products

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

Request A Quote

Please check your email address.
Your message must be at least 20 characters.