Full Turnkey PCB Assembly Service: 3-Day Prototype & 7-Day Volume Production with 1-48 Layer Capability
Ring PCB delivers comprehensive Full Turnkey PCB Assembly—from PCB fabrication and component sourcing to SMT/THT assembly, testing, and shipping—providing production-ready boards with one accountable partner.
Full Turnkey PCB Assembly is an end-to-end manufacturing model where a single supplier manages PCB manufacturing, BOM procurement, stencil & tooling, assembly, inspection/testing, and logistics. You send design data (Gerber/ODB++, BOM, pick-and-place/CPL, assembly drawings), and we return finished, tested PCBA ready for integration.
- 17 years of PCB & PCBA specialization with 500 employees focused on quality and on-time delivery
- Two self-owned factories in Shenzhen and Zhuhai with 5,000+ m² modern production lines
- Certified to ISO9001, ISO14001, ISO13485, IATF16949; builds to IPC-A-610 Class 2/3
- Rapid cycles: 3-day functional prototype, 7-day volume build (typical, design-dependent)
- Global reach: exports to 50+ countries/regions with robust supply-chain and traceability
- Industry customization: automotive, medical, industrial control, telecom/5G, consumer, energy, and more
- Advanced QA: 3D AOI, X-ray (BGA/uBGA), flying-probe/ICT/FCT, full DFM/DFT support
- One PO, one schedule, one warranty—fewer handoffs, faster launch
- DFM/DFT reviews before build to prevent re-spins and improve yield
- Trusted component sourcing from authorized channels; automated alternates proposal
- Process transparency: traveler records, lot/barcode traceability, certificates on request
- Scalable from 1 to 100k+ units with the same quality system and documentation set
- Design confidentiality safeguarded by controlled access and NDAs
| Category | Capability |
|---|---|
| PCB Types | FR-4, High-TG, Halogen-Free, Rogers/PTFE & hybrids, Aluminum IMS, Rigid-Flex |
| Layer Count | 1-48 layers (HDI, blind/buried vias, microvias) |
| Board Size / Thickness | ≤ 510 mm × 460 mm; 0.2-4.0 mm (±10%) |
| Copper Weight | 0.5-6 oz (inner/outer) |
| Min Trace/Space | 3/3 mil (design-dependent) |
| Surface Finish | ENIG, Imm Ag, Imm Sn, OSP, Lead-Free HASL, ENEPIG |
| Component Range | 01005 to BGA/uBGA, QFN, LGA, CSP, press-fit |
| BGA Pitch / Rework | Down to 0.3 mm; X-ray inspection & reball/rework |
| Lead Times | Prototype 3 days; Volume 7 days (typical) |
- Automotive & New Energy: IATF16949 workflows, PPAP, traceability
- Medical & Health: ISO13485 documentation, lot control, biocompatible materials
- Industrial & Power: thick-copper, high-current rails, thermal vias/heatsinking
- Telecom/5G & Computing: controlled-impedance, low-loss materials, high-speed BGA
- Consumer Electronics & IoT: compact layouts, cost-down engineering, rapid scaling
Ready to build? Send Gerber/ODB++, BOM, and CPL to info@ringpcb.com or visit our site: https://www.turnkeypcb-assembly.com
Ring PCB—your partner for reliable Full Turnkey PCB Assembly from prototype to mass production.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.